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Guru3D.com » News » Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove

Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove

by Hilbert Hagedoorn on: 06/10/2020 05:01 PM | source: | 7 comment(s)
Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove

You may have seen the Samsung Galaxy Book S announcement last week. Similar to a further design with Levono, the Lenovo ThinkPad X1 Fold, the first fully functional PC with a folding OLED display unveiled at CES 2020 Lakefield has surfaced. This is a Hybrid chip based on 4+1 processors.

Lakefield is a mobile-first product, with a firm focus on battery life and new designs, it introduces several significant technical innovations, including Foveros 3D Packaging, package-on-package memory, a hybrid CPU architecture combining four all-new 10nm ‘Tremont’ cores with the performance scalability of a 10nm ‘Sunny Cove’ core (as used in Ice Lake), and native dual internal display pipes, to name just a few. 

 

 

-- Intel --  Intel Core Processors with Intel Hybrid Technology combines Foveros 3D stacking and Hybrid CPU architecture in a single 12x12x1mm chip, delivering low power and Core performance in a small footprint. The combination of both delivers PC compute in smaller devices and enables new form factors.

This innovative hybrid processor combines the best of two IA architectures, bringing together one Sunny Cove core and four Tremont cores. Onboard Hardware Guided Scheduling works real-time with Windows 10 scheduler to make intelligent decisions on thread scheduling. Foreground, performance threads are prioritized on Sunny Cove delivering responsive performance by leveraging Intel Turbo technology. Background and low priority threads are scheduled on Tremont for efficiency. Intel® Adaptix™ Technology orchestrates power and performance to the tune of the user’s instantaneous demands.

Intel Core Processors with Intel Hybrid Technology leverage some of the same IPs from 10th Gen Intel® Core™ processors to deliver Core performance and responsiveness on light productivity applications. Gen 11 Graphics and Media lets you indulge in 720p games with smooth frame rates. Enjoy 4K HDR movies while on the GO. Edit 4K videos on the fly, take and modify high resolution photos for social sharing on the GO. The Intel® Hybrid Processor brings AI powered computational capability to digital tools by leveraging Gen11 Intel UHD Graphics. Put this creative intelligence to use across a range of use cases.

Why They’re Great for Innovative PC Form Factors: Intel Core processors with Intel Hybrid Technology deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board sizei and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable screen devices while delivering the PC experiences people expect. They are also:

  • The first Intel Core processors shipping with attached package-on-package (PoP) memory, further reducing board size.
  • The first Intel Core processors to deliver as low as 2.5mW of standby SoC power—an up to 91% reduction compared to Y-series processors—for more time between charges. 
  • The first Intel processors to feature native dual internal display pipes, making them ideally suited for foldable and dual-screen PCs.

 



Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove




« Review: Z490 Aorus PRO AX · Intel Talks Lakefield (Foveros 3D) Processor, 5 cores - 4 Tremont and 1 Sunny Cove · GeIL Announces ORION Series DDR4 Memory up to 4000MHz CL18 64GB »

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Venix
Senior Member



Posts: 3113
Joined: 2016-08-01

#5798629 Posted on: 06/12/2020 07:32 AM
But why they did not use glue to secure the pieces is not like the final product will allow people to remove and re-arange things

Undying
Senior Member



Posts: 22337
Joined: 2008-08-28

#5798639 Posted on: 06/12/2020 07:49 AM
A ways the waste the the money.

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