Intel Shows Xe HPC Multi-Chip Module Die
On Twitter Intel is showing a Xe HPC Multi-Chip Module photo (Ponte Vecchio), the tweet was made by Ex AMD's Raja Koduri. This is the first picture showing the chip that way as the heat spreader has been taken off.
The graphics processor is a multi-chip module and shows two very big main dies (7 nm) likely fabbed at TSMC. And no this is not a gamers processor, instead, it'll be targeted at datacenter centric environments. The package seems to be almost twice the size of what Nvidia's A100 top model for servers utilize.
You are looking at Frankenstein in a silicon form as seven advanced technologies into a single package have been applied, combined with four different production processes of the chips. What's interesting to see is that surrounding the two dies, you can see different sized memory chips. The square ones are HBM2/HBM3, the smaller ones we're not sure of. It could be GDDR DRAM functioning as some sort of cache, or even 3D XPoint, NAND flash in Intel's Foveros packaging. Anyway, an impressive setup none-the-less, feast away, here it is:
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At least the Intel execs and CEO behind that slide have since been kicked out of the company. Things change when people change.
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Isn't their chief propaganda manager still at the company? They're obviously not going to call the job what it is, so they made up some BS title like something "strategist". I forgot the slimy weasel's name but they've been doing such scumbag propaganda that it's actually illegal breaking a ton of regulations and agreements they had based on past lawsuits.
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Considering this design will trickle down to consumers, this is looking pretty good in terms of competition in the future.
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This is going to be exceptional for APU's. I have said it a few times but people are not seeing it yet for the most part. Many gamers will be running APU's in 5-7 years. Just need another node shrink and HBM to come down in cost. Once cost and the node allows to have 8+ core CPU, large GPU, and onboard HBM things are going to get interesting. Intel's approach is extremely elegant far more elegant than AMD's but then AMD has actual chiplets today.
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I'll just leave this slide here hey. Not "glued-together" hey Intel.