Intel renames nodes: 10nm+ and 7nm become Intel 7 and 4

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Processes at Intel will no longer be measured in nanometers. To differentiate itself from rivals, the company is adopting new names that are intended to provide a "clearer picture." As a result, Intel's upcoming 10nm+ and 7nm nodes will be named Intel 7 and 4.



Intel 7 is the new name for 10nm Enhanced SuperFin, which Intel previously called SuperFin. Intel's 10nm SuperFin process, used in Tiger Lake processors, has been improved. A performance gain per watt of 10 to 15 percent over 10nm SuperFin has been achieved with Intel's 7-nanometer process, which is now in volume production.

Alder Lake CPUs for desktops and laptops will be available this year, made with Intel's 7-process technology. 

Intel renames its upcoming 7nm process Intel 4 to avoid confusion with its predecessor, Intel 3. Intel will use euv in production for the first time. About 20 percent more performance per watt than Intel 7 is expected with this generation. Products should appear in 2023 if production begins in the second half of 2022. Granite Rapids for data centers and Meteor Lake processors for consumers. An 18 percent increase in performance per watt is expected with Intel 3, thanks to the addition of euv layers and FinFET optimizations. A new Intel node is planned for the second half of 2023.


Intel TSMC Samsung
10nm 10nm 7nm 10nm (LPP) 7nm
Gate pitch 54nm 66nm 57nm 64nm 54nm
metal pitch 36nm 44nm 40nm 44nm 36nm
Fin pitch 34nm 36nm 30nm 42nm 27nm

Comparison of three reference pitches, the minimum distance between two parts, in processes from Intel, TSMC and Samsung.


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