Intel Lakefield CPU Combines fast and economical cores
Intel has been talking about Lakefield, the processor will use different stacked CPU cores inside the package, making it a hybrid design based on Foveros technology. The processor only measures 12 by 12 mm and will get one main core and four atom cores combined with a chipset and LPDDR4X.
Intel presented the Lakefield chip at the CES 2019, it is intended for convertibles and uses a design of several vertically stacked dies in an effort to achieve performance with high efficiency in the smallest possible space. Lakefield in idle only would use 2 milliwatts.
The design consists of three parts and is strongly reminiscent of those used in smartphones, with one big difference: instead of putting memory on a die, Intel pairs two all managed by the so-called 3D Foveros packaging technology, which basically is 3D stacking to connect multiple chiplets. Intel uses an interposer, which is produced in a 22FFL process and contains I/O functions such as SATA or USB. On top of that, through-contacted (TSV) there will be a 10nm based compute die as well as the RAM controller with a 64-bit interface, and at the top then the LPDDR4X main memory as a classic PoP (Package on Package). Intel previously strictly differentiated between core and Atom processors, the Compute-Die combines these two types of x86 CPU cores; a bit like ARM's big-LITTLE methodology. A Sunny Cove core, that's the name of the architecture of the upcoming Ice Lake chips, is expected next to four Tremont cores (next-gen Atom cores). The five cores will share 4 MB of L3 cache and are tied to a Gen11 GT2 integrated graphics unit with 64 execution units.
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From Intel's first attempt? No, not at all. At least, they weren't any good at what they were supposed to be.
As for Lakefield, there's not enough info for anyone to make judgment.
There were 2 Atom attempts.
One was over decade old CPUs for notebooks. That attempt wasn't good at all.
Second attempt was smartphone/tablet Atom SoCs. They were pretty good, better than at the time ARM competitors, but they failed in marketing, so they suspended the model row. Morganfield and Willow Trail were cancelled. Now they are resuming SoCs with P1275 process.
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Do not mix up most desktop users with gaming users. Most desktop users do benefit a lot with light integrated GPU.
For gamer users, once Intel released gaming dGPU, they could do DX12 explicit multi-adapter support. It depends on gaming support, but by the time DX12 will gain popularity. So you will have your several fps increase.
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One was over decade old CPUs for notebooks. That attempt wasn't good at all.
Second attempt was smartphone/tablet Atom SoCs. They were pretty good, better than at the time ARM competitors, but they failed in marketing, so they suspended the model row. Morganfield and Willow Trail were cancelled. Now they are resuming SoCs with P1275 process.
Huh? The 2nd attempt was atrocious. They were horribly power hungry (even when idle) and their performance-per-watt suffered when trying to make battery life better. Intel can shove themselves anywhere they want and make decent sales so long as the product is "decent" or better. The reason this platform failed is because it was an inferior competitor to what ARM had to offer.
Do not mix up most desktop users with gaming users. Most desktop users do benefit a lot with light integrated GPU.
For gamer users, once Intel released gaming dGPU, they could do DX12 explicit multi-adapter support. It depends on gaming support, but by the time DX12 will gain popularity. So you will have your several fps increase.
Fair enough, but that was a little besides the point anyway. I was more addressing the comment specific to D3M1G0D's point about people who feel the iGPU is wasted die space.
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Never were truer words said!
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Well, that, and/or "this is burning my leg!" as well as "seriously, 40% battery life!? I just charged this an hour ago!"