Intel China President and CEO Wang Rui announced the completion of Intel's Intel 18A (1.8 nm) and Intel 20A (2 nm) manufacturing processes at an event.

These technologies will be utilized for the production of company products and chips for Intel's Foundry Services (IFS) customers. The new manufacturing nodes are set to be deployed commercially in 2024, with the 1.8nm version being the most advanced technology available, surpassing TSMC and Samsung Foundry. Intel plans to use RibbonFET transistors for its Intel 20A technology fabrication with backside power delivery, while the 18A line will utilize PowerVia technology for further reduction in component size. Intel CEO Pat Gelsinger remains confident in the company's progress and actively engages with its top 10 customers to ensure continued growth.

Intel CEO Pat Gelsinger is sure that this will benefit his company. "We have active milestone mapping engaged with seven of our foundry's top 10 clients. This has been complemented by sustained expansion, resulting in the addition of 43 new leads and accompanying chips to our ecosystem."

Everything is in upheaval for Gelsinger. "With Intel 18A, we are making progress; we have already shared the engineering version of the 0.5 process design kit with our key clients, and we hope to have a final production version in the coming weeks."