In 2023, Samsung plans to produce 32GB DDR5 chips, followed by 1TB modules in 2024. Samsung intends to deploy all-new DDR5 server memory modules, including the industry's first 512GB RDIMM/LRDIMM.
Samsung's next DDR5 innovation, a 32Gb IC, will be available in early 2023, allowing the company to produce a 1TB memory module in late 2023 or early 2024. In two years, Samsung will release 7200 MT/s ICs.
JEDEC's DDR5 specification is helpful to server platforms. They also enhance capacity, reliability, and yield per chip and per module. The specification allows for 64GB monolithic DDR5 memory devices and 16 DDR5 ICs per chip (up to 16 ICs whose capacity is lower than 64Gb). 32Gb DDR5 ICs should come as no surprise. High speeds are also important to enthusiasts, thus Samsung is increasing the performance of DDR5 products. For next client PC systems, the company will introduce 5200 MT/s - 5600 MT/s ICs. We expect Corsair and G.Skill to use these chips to make modules with speeds ranging from 6800 MT/s to 7000 MT/s and higher, but they will require higher voltages.
In 2025, Samsung anticipates 7200 MT/s DDR5 chips at 1.1 Volts. Samsung has mentioned DDR5-7200, but has not stated when smartphones will be available. During the webinar, the company eventually revealed a slide for 'DDR5-7200+' in 2025. Memory module specialists can get 10,000+ MT/s with such ICs. To support AMD and Intel's next-generation server systems, Samsung intends to deploy all-new DDR5 server memory modules, including the industry's first 512GB RDIMM/LRDIMM. Samsung's next DDR5 innovation, a 32Gb IC, will be available in early 2023, allowing the company to produce a 1TB memory module in late 2023 or early 2024. In two years, Samsung will release 7200 MT/s ICs.
JEDEC's DDR5 spec aids server platforms with 1TB DDR5 RDIMMs in 2024 and 2TB Modules on Horizon. They also enhance capacity, reliability, and yield per chip and per module. The specification allows for 64GB monolithic DDR5 memory devices and 16 DDR5 ICs per chip (up to 16 ICs whose capacity is lower than 64Gb). 32Gb DDR5 ICs should come as no surprise. To commemorate its completion, Samsung will produce 32GB DDR5 cellphones early next year. By the end of 2023, Samsung may release 32GB unbuffered DIMMs for client PCs based on these processors. Later, for 2024-2025 server platforms, the company will manufacture 1TB DDR5 memory modules with 32 8-Hi 32GB stacks.
DRAM manufacturers, like as Samsung, now use 8-Hi stacks with up to eight memory devices, but will transition to larger stacks in a few years. By stacking 16 32Gb or 8 64Gb DRAM ICs, Samsung can build 2TB server-grade DDR5 modules. This will enable computers with tens of terabytes of memory per socket to be built (e.g., a 12-channel memory subsystem supporting two DIMMs per channel might get up to 48TB of memory). Single-sided 32GB DIMMs will be inexpensive once Samsung's 32Gb DDR5 memory yields approach 16Gb IC levels, allowing desktop enthusiasts to equip their PCs with 128GB of memory without breaking the bank.
In 2024, 1TB DDR5 RAM will be available, followed by DDR5-7200 RAM in 2025 says Samsung
