G.SKILL Announces New DDR4 Specifications for Intel X299 HEDT Platform

by Hilbert Hagedoorn on: 06/23/2017 04:23 PM | source: | 0 comment(s)

G.Skill is excited to announce new high-speed DDR4 memory specifications designed for the latest Intel Core X-series processors and X299 chipset motherboards. All the new memory kits are built with high performance Samsung 8Gb ICs, and tested under the highest standards of the Trident Z family.

Taipei, Taiwan (23 June 2017) – G.SKILL International Enterprise Co., Ltd., the world’s leading manufacturer of extreme performance memory and gaming peripherals, announces new high-speed DDR4 memory specifications designed for the latest Intel® Core™ X-series processors and X299 chipset motherboards. All the new memory kits are built with high performance Samsung 8Gb ICs, and tested under the highest standards of the Trident Z family.

The Fastest DDR4-4400 CL19 8GBx2 Designed for Kaby Lake-X

With the improvement of overclocking performance on the latest Intel® Core™ X-series processor and X299 chipset, G.SKILL is thrilled to release the fastest DDR4-4400 CL19-19-19-39 8GBx2 dual-channel memory kit designed for Kaby Lake-X processor. This high-end DDR4 memory kit will be available under the Trident Z RGB series and an all-new Trident Z Black series

New Quad-Channel Memory Kits for Skylake-X, Up to DDR4-4200 64GB (8GBx8)

In addition to the fastest 4400MHz dual-channel memory kit, G.SKILL introduces several new quad-channel memory kits, up to DDR4-4200MHz CL19-19-19-39 64GB (8GBx8) of extreme speed and high capacity. These new ultimate memory kits are designed to unleash the maximum performance of the latest Intel® Core™ i9 processors. Please refer to the following images for detailed specifications of the new memory kits and the stress test screenshot of the DDR4-4200MHz 64GB kit on the ASUS Prime X299-Deluxe motherboard and Intel® Core™ i9-7900X processor.

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