Government funded Chinese NAND manufacturer, Yangtze Memory Technologies is to reveal more details about its Xtacking technology during Flash Memory Summit held from the 6th till the 9th of August this year. Xtacking technology should bring DDR4 RAM speeds to NAND memory.
In a press release, the company announces that its CEO, Simon Yang, will talk at the Flash Memory Summit, “where he will illustrate how the company’s new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.”
Transfer rates of DDR4 memory can range from 17 GB/s for DDR4 2133 up to 25.6GB/s for DDR4 3200. Current fast NVMe SSDs can achieve transfer rates of up to 3,500 MB/s for sequential reads, and up to 2,100 MB/s for sequential writes, which means drives with, “patent-pending”, Xtacking technology need to be 5-7 times faster than current NVMe SSDs.
Wuhan, China, July 25, 2018 - Yangtze Memory Technologies Co., Ltd (YMTC), a new player in the NAND industry, will be joining Flash Memory Summit this year for the first time, delivering a much-anticipated keynote address to reveal its ground-breaking technology - XtackingTM. YMTC is the first Chinese company to take part in the high-entry-barrier NAND flash memory industry with its new architecture for unprecedented performance, higher bit density, and faster time-to-market.
Simon Yang, YMTC CEO, will deliver a keynote address, Unleashing 3D NAND’s Potential with an Innovative Architecture, on August 7th, from 3:00 p.m. at the Mission Ballroom in the Santa Clara Convention Center, where he will illustrate how the company’s new technology can increase NAND I/O speed up to DRAM DDR4 while delivering industry-leading bit density, marking a quantum leap for the NAND market.
The XtackingTM technology will enable the production of NAND that has unprecedented I/O speed and as a result, increase the performance of NAND solutions such as embedded UFS, client SSD, and enterprise SSD to a level that is unheard of. With help from customers, industry partners, and standard bodies, XtackingTM will bring in a whole new chapter in high performance NAND solutions for smartphone, personal computing, data center, and enterprise applications.
The XtackingTM technology enables parallel processing of the NAND array and periphery. This modular approach to 3D NAND development and manufacturing will shorten the time-to-market for new generation of 3D NAND and open the possibility for customized NAND flash products.
Chinese company with $24 billion funding claims its will bring DDR4 speeds to NAND
