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Guru3D.com » News » Chief Engineering behind Intels hardware division leaves company

Chief Engineering behind Intels hardware division leaves company

by Hilbert Hagedoorn on: 07/28/2020 07:39 AM | source: | 30 comment(s)
Chief Engineering behind Intels hardware division leaves company

The chief engineering (basically the number two in the company) officer of Intel, Venkata 'Murthy' Renduchintala, leaves the company on August 3rd. He was responsible for the 7nm chips division at Intel. That division is now being split up and will have managers who will report directly to CEO Bob Swan.

Developing the 7nm and 5nm process will from now on fall under the new Technology Development department, led by Mike Mayberry. Mayberry has been with Intel for 36 years (who will retire later this year). No specific reason for splitting up or leaving Renduchintala is given. However, with this step, the company says 'to improve focus and responsibility'.

SANTA CLARA, Calif., July 27, 2020 – Today, Intel CEO Bob Swan announced changes to the company’s technology organization and executive team to accelerate product leadership and improve focus and accountability in process technology execution. Effective immediately, the Technology, Systems Architecture and Client Group (TSCG) will be separated into the following teams, whose leaders will report directly to the CEO:

  • Technology Development, led by Dr. Ann Kelleher. An accomplished Intel leader, Kelleher has been head of Intel manufacturing, where she ensured continuous operations through the COVID-19 pandemic while increasing supply capacity to meet customer needs and accelerating the ramp of Intel’s 10nm process. She will now lead Intel technology development focusing on 7nm and 5nm processes. Dr. Mike Mayberry, who has been leading Technology Development, will consult and assist in the transition until his planned retirement at the end of the year. Mayberry has a 36-year track record of innovation at Intel, during which he has made key contributions in technology development and as the leader of Intel Labs.
  • Manufacturing and Operations, led by Keyvan Esfarjani. Esfarjani most recently led manufacturing for Intel’s Non-Volatile Memory Solutions Group (NSG), in which role he set the vision and strategy for Intel’s memory manufacturing and led a rapid expansion of capacity. He will now lead global manufacturing operations and continue Kelleher’s work driving product ramp and the build-out of new fab capacity.
  • Design Engineering, led in the interim by Josh Walden while Intel conducts an accelerated global search to identify a permanent world-class leader. Walden is a proven leader in technology manufacturing and platform engineering. Most recently, he has been leading the Intel Product Assurance and Security Group (IPAS), which will continue to report to him.
  • Architecture, Software and Graphics will continue to be led by Raja Koduri. Koduri has responsibility for driving the development of Intel’s architecture and software strategy, and dedicated graphics product portfolio. Under his leadership, we will continue to invest in our software capability as a strategic asset and further build-out software engineering with cloud, platform, solutions and services expertise.
  • Supply Chain will continue to be led by Dr. Randhir Thakur.  Thakur will report directly to the CEO as chief supply chain officer, recognizing the ever-growing importance of this role and our relationships with key players in the ecosystem. Thakur and his team are charged with ensuring supply chain is a competitive advantage for Intel.

As a result of these changes, Murthy Renduchintala will leave Intel on Aug. 3, 2020.

“I look forward to working directly with these talented and experienced technology leaders, each of whom is committed to driving Intel forward during this period of critical execution,” said Swan. “I also want to thank Murthy for his leadership in helping Intel transform our technology platform. We have the most diverse portfolio of leadership products in our history and, as a result of our six pillars of innovation and disaggregation strategy, much more flexibility in how we build, package and deliver those products for our customers.”







« MMD announces the new Philips 498P9, impressively large · Chief Engineering behind Intels hardware division leaves company · Gigabyte Releases AORUS Gen4 SSD NVMe SSDs »

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cryohellinc
Senior Member



Posts: 3349
Joined: 2014-10-20

#5812836 Posted on: 07/28/2020 08:47 AM
Apparently there was a significant power struggle as of late, and this guy was fully involved in it.

RooiKreef
Senior Member



Posts: 408
Joined: 2016-06-08

#5812837 Posted on: 07/28/2020 08:52 AM
Sounds to me like a typical corporate company problem. The big boss doesn't want to take the blame and now he is looking for someone to sack.

Deleted member 213629
Unregistered



#5812840 Posted on: 07/28/2020 09:02 AM
Christ. What else is new with the corporate ladder in America & the greater rest of the world but we definitely know how to do it better than anybody else :cool:

Astyanax
Senior Member



Posts: 9512
Joined: 2018-03-21

#5812841 Posted on: 07/28/2020 09:02 AM
Sounds to me like a typical corporate company problem. The big boss doesn't want to take the blame and now he is looking for someone to sack.


Bob Swan isn't the head of engineering, and Murthy wasn't someone he hired i the first place, he was one of that incompetent Brian Krzanich hires back when he was running intel into the ground by giving the finger to the server and desktop market.

Celcius
Senior Member



Posts: 308
Joined: 2018-06-21

#5812869 Posted on: 07/28/2020 10:01 AM
So, what are the odds that Renduchintala re-surfaces at AMD at some point?

I wonder if Jim Keller saw all this coming? And, I'll bet Dr. Su is sleeping quite soundly these days.

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