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Guru3D.com » News » ASUS Is looking into applying liquid metal opposed to TIM in some of their Game laptops

ASUS Is looking into applying liquid metal opposed to TIM in some of their Game laptops

by Hilbert Hagedoorn on: 04/02/2020 05:36 PM | source: | 30 comment(s)
ASUS Is looking into applying liquid metal opposed to TIM in some of their  Game laptops

Serious overclockers and enthusiasts have long used liquid metal on high-end machines, but it’s typically applied by hand, which isn’t feasible for mass production. For more than a year, we’ve been developing a proprietary process and machine capable of applying it at scale. ASUS sees that differently.

Liquid metals have low melting points that render them fluid at room temperature. These alloys are highly conductive, so they’re extremely effective at transferring thermal energy between surfaces like a processor die and heatsink. The benefits are well-established in overclocking and DIY circles. ASUS internal testing reinforced the appeal for gaming laptops and their engineers observed a 10~20°C reduction in temperatures depending on the CPU.

-- ASUS -- 

The improved thermal interface creates margin that can be used in different ways. Lower temperatures help processors sustain higher clock speeds for longer, and also prevent fans from ramping up to louder RPMs. The additional thermal headroom can also be used to reach even faster frequencies and higher performance.

ASUS applies Conductonaut from Thermal Grizzly because it has a lower concentration of tin, which isn’t as conductive as the gallium and indium that also make up the alloy. Rather than working closely with Thermal Grizzly like we do with other partners, we purchased initial quantities more casually to keep the project a secret. Not even Intel knew of our plans during development.

Step one is essentially painting; a mechanized arm wets its brush in a container of liquid metal and then glides back and forth across the CPU. It performs exactly 17 passes, which our extensive testing determined is the ideal number for complete coverage. Rather than simply sliding back and forth, the machine mimics human motion by also moving vertically to add a subtle arc.

 

 

We did a lot of internal testing to determine how much liquid metal is best. Too little reduces the efficiency of thermal transfer, but too much increases the likelihood of leakage and needlessly wastes an expensive material. The first stage doesn’t apply enough, so a second machine injects more compound at two points on the die. The surface tension created by the initial coat helps spread the additional material without subsequent brushing.

Finding the right components for the second stage was one of the most challenging aspects of the project. Although we were able to use off-the-shelf parts, it was extremely difficult to source ones capable of not only housing liquid metal, but also reliably dispensing a precise dose. The syringe and pump are made of stainless steel to avoid reacting with the compound.

ROG is so metal

Our liquid metal project is still ongoing as we continue pursuing better cooling for gaming laptops. Last year’s ROG Mothership was our first system to take advantage of the technology. Its limited production run allowed us to pilot an earlier version of the process that relied on hand-painting the initial coat. We automated the brushing stage to improve efficiency and redesigned the shim to work across different motherboards, enabling a much wider rollout across the full family of ROG gaming laptops with 10th Gen Intel Core processors. Patents on our liquid metal process and sponge formally recognize the innovation ROG continues bringing to gaming laptops. The superior thermal compound enhances cooling enough to tangibly improve performance, temperatures, and acoustics. Where it was once restricted to the realm of hardcore overclocking, we’re making liquid metal available to a much larger audience.

ROG laptops with Thermal Grizzly Conductonaut liquid metal will be available in Q2 of this year. Contact your local ROG representative for details on pricing and availability in your region, and see our 2020 gaming laptop guide to learn about the lineup.



ASUS Is looking into applying liquid metal opposed to TIM in some of their  Game laptops ASUS Is looking into applying liquid metal opposed to TIM in some of their  Game laptops




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rl66
Senior Member



Posts: 2671
Joined: 2007-05-31

#5775945 Posted on: 04/03/2020 05:37 AM
more marketing than real needed...

Corbus
Senior Member



Posts: 2446
Joined: 2009-04-27

#5775974 Posted on: 04/03/2020 08:56 AM
Doesn't this stuff contain gallium, and doesn't gallium just "melt" aluminium when it comes into contact with it? Seems like a not great idea.


Yes,yes and its not a great idea only if its used with aluminium. That would be nasty.

fry178
Senior Member



Posts: 1655
Joined: 2012-04-30

#5775996 Posted on: 04/03/2020 10:18 AM
So far i only applied it once (HS+copper block) unless i swapped cpus, but usually in use for more than 1y without any problem
to remove the block (make sure to twist, not "pull" on the block) or any kind of "drying out".
Never seen any leakage, especially when properly applied, its a lot less material than what you usually apply with normal TP,
its similar to wetting the surface (HS) with a water like fluid.
Especially when using a proper quality cooler/block that's flat and TIM doesnt need to fill a gap.

mannix
Member



Posts: 59
Joined: 2010-12-07

#5776010 Posted on: 04/03/2020 12:00 PM
The difference between the proper amount and a bit too much is extremely subtle and will lead to leakage.
Liquid metal will actually change state to liquid at high temperatures, as the name implies.

I did burn a mainboard with my i4770k; first time I applied it and I thought it was right.
But it wasn't, just a micro drop more than needed.
With time and gravity, on a tower, the liquid metal will slowly find it's way downward and will escape the CPU heat spreader.
After 7-8 months after POST, zap, system off, board dead.

I tried to make a "wall" to contain a possible leakage using a non conductive adhesive tape at the bottom.
But it's really challenging with an air cooler, you have to set it up after the cooler is mounted.
Did my best but it wasn't enough; these micro drops are incredibly small and they are able to go though infinitely small openings.
Had to look with a lens for 40 minutes to find it; but I knew it was there because once I removed the cooler the liquid metal had clearly moved from top to bottom.
Enough to be a bit dry on top and a bit more dense on the bottom.

I have now a Ryzen 3800x and didn't apply it again; for now I stick to Kryonaut.
The only safe way I've seen to apply it is a perfectly fit silicon mask around the heat spreader; it's how HP is applying it in their notebooks.
I hope some day Roman "der8auer" will jump in and make a professional grade product :)

The 10-20 degrees are just marketing; unless they are comparing it with one of those terrible TIM they still use in cheap notebooks.
The real difference from my previous high end TIM was 2-5 degrees; it's amazing cause nothing else can do that but very far from those numbers.

DeskStar
Senior Member



Posts: 1093
Joined: 2011-01-11

#5776011 Posted on: 04/03/2020 12:11 PM
The only way to live these days.... Liquid metal for the win baby!!

Have this on my 3900X and 3960X and these bad boys are cold as ICE!.!.! Damn 3960X doesn't pass 50C under massive load! Then again she's under a huge amount of H2O with an EK block...

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