News from the other side of the globe reaches us and is saying that AMD is working hard to embed DRAM and System Memory onto processors into one single package. The RAM would get connected through silicon-through-channels.
In many segments manufacturers are already working on similar technologies, look at HBM2 and NAND 3D Vertical stacking. For a processor, this, however, is new as the aforementioned technologies are based on a package-on package design. .The new tech would not make the actual memory faster but will make it work more efficient in overall performance.
Intel is doing similar things with under the codename foveros
AMD Working on Vertical (3D) Stacking of DRAM onto processors
