AMD Tries to steer Mobo Manufacturers away from Intel WIFI Chips

MediaTek and AMD have collaborated on Wi-Fi 6E chips for use in next-generation Ryzen processors, which are powered by MediaTek's Filogic 330P chipset.

AMD's Wi-Fi 6E modules for forthcoming Ryzen-based laptops and desktops will be powered by MediaTek, according to a statement released today by the companies. It is expected that the AMD RZ600 series Wi-Fi 6E modules, which are based on MediaTek's Filogic 330P chipset, will be the first to hit the market.

The companies claim that they have "developed and certified PCIe and USB interfaces for modern sleep states and power management," and that the company's own optimization and testing process will assist laptop and desktop manufacturers in saving time during product development and manufacturing.

Currently, there are two models available in the RX616 series: the RX616, which is faster (it can transmit data at a rate of up to 2.6 Gbps) and works with 160 MHz WiFi, which should support 6GHz spectrum; and the RZ608, which can transmit data at a rate of up to 1.2 Gbps and relies on 80MHz bandwidth. The Fliogic 330P chipset is compatible with Wi-Fi 6 and 6E networks, as well as Bluetooth 5.2 technology. The RZ616 is designed to fit in M.2 2230 and extremely short M.2 1216 slots, whereas the RZ608 is designed to fit exclusively in M.2 2230 slots. A compact chip for "laptops of all sizes," according to MediaTek, is made possible by its power and low noise amplification technology, though I've never seen a laptop too small for a Wi-Fi card in my travels.

AMD's reliance on Intel, which manufactures its own Wi-Fi modules (and just acquired Rivet Networks, which owns the Killer brand, which caters to the wireless demands of gaming laptops), is reduced as a result of the partnership with MediaTek. Reports about the pairing began to circulate as early as September 2020.

AnandTech discovered that the RZ608 is in fact a repackaged MediaTek MT7921K module with an AMD logo on it. It is unknown whether AMD had a greater influence on the RZ616. The new processors are expected to emerge in Ryzen laptops and desktops in 2022.

Laguna Beach, Calif. 11/18/2021 MediaTek and AMD (NASDAQ: AMD) today announced a collaboration to co-engineer industry leading Wi-Fi® solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.

To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe® and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. Further, the optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

“MediaTek is already the Wi-Fi leader in a number of different segments, including smart TVs, routers and voice assistants. The new Filogic 330P chipset further broadens our connectivity portfolio as we continue to expand our footprint in the PC market,” Alan Hsu, corporate vice president and general manager, Intelligent Connectivity at MediaTek. “With this high throughput and ultra-low power chipset powering the next generation of AMD laptops, consumers can enjoy seamless connectivity and longer battery life while they game, stream and video chat.”

“Having fast and reliable wireless connectivity is crucial, especially as consumers’ speed, bandwidth and performance demands rise due to increased video calling, streaming and gaming,” said Saeid Moshkelani, senior vice president and general manager, client business unit, AMD. “We believe that combining powerful AMD Ryzen processors with MediaTek’s leadership advanced connectivity technologies will deliver an all-around incredible computing experience.”

Filogic 330P supports the latest connectivity standards of 2x2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz), along with Bluetooth® 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum at 160MHz channel bandwidth. The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint which enables the Filogic 330P chipset to be embedded in laptops of all sizes.

The AMD RZ600 Series Wi-Fi 6E modules expand AMD’s Wi-Fi capabilities, bringing excellent connectivity solutions to OEMs and end users, whether they are playing the latest interactive games, working remotely, or completing a big project.