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Guru3D.com » News » AMD EPYC CPUs, AMD Radeon Instinct GPUs to power Cray Supercomputer

AMD EPYC CPUs, AMD Radeon Instinct GPUs to power Cray Supercomputer

by Hilbert Hagedoorn on: 05/07/2019 01:47 PM | source: | 18 comment(s)
AMD EPYC CPUs, AMD Radeon Instinct GPUs to power Cray Supercomputer

AMD and Cray unveil what is expected to be the world’s fastest supercomputer – defining a new standard for high-performance computing and pushing the technology boundaries of computational science to take the industry into the Exascale era. 

The new system, called Frontier, is planned to come online in the U.S. in 2021 with over 1.5 exaflops of processing power. The total system contract award is valued at more than $600M USD for the system and technology development. Together with the Cray Shasta architecture, AMD is excited to build on leadership hardware and software with the singular vision of solving the toughest computing challenges in the world today. AMD innovations in Frontier include: 

  • High Performance Computing (HPC) and Artificial Intelligence (AI) optimized, custom AMD EPYC CPU and purpose-built Radeon Instinct GPU processors
  • High Bandwidth Memory (HBM)
  • Tightly integrated 4:1 GPU to CPU ratio
  • Custom, high-speed coherent Infinity Fabric connection
  • Enhanced, open ROCm programming environment for AMD CPUs and GPUs support.

With this announcement, AMD and Cray are driving a new HPC paradigm to support the complex compute, interconnect, software and storage requirements that Exascale computing demands.

SANTA CLARA, Calif. — May 7, 2019 — AMD (NASDAQ: AMD) today joined the U.S. Department of Energy (DOE), Oak Ridge National Laboratory (ORNL) and Cray Inc. in announcing what is expected to be the world’s fastest exascale-class supercomputer, scheduled to be delivered to ORNL in 2021. To deliver what is expected to be more than 1.5 exaflops of expected processing performance, the Frontier system is designed to use future generation High Performance Computing (HPC) and Artificial Intelligence (AI) optimized, custom AMD EPYC™ CPU, and AMD Radeon™ Instinct GPU processors. Researchers at ORNL will use the Frontier system’s unprecedented computing power and next generation AI techniques to simulate, model and advance understanding of the interactions underlying the science of weather, sub-atomic structures, genomics, physics, and other important scientific fields.

“AMD is proud to partner with Cray and ORNL to deliver what is expected to be the world’s most powerful supercomputer,” said Forrest Norrod, senior vice president and general manager, AMD Datacenter and Embedded Systems Group. “Frontier will feature custom CPU and GPU technology from AMD and represents the latest achievement on a long list of technology innovations AMD has contributed to the Department of Energy exascale programs.”

AMD innovations to be used in the Frontier system include:

  • Future-generation High Performance Computing (HPC) and Artificial Intelligence (AI) optimized, custom AMD EPYC CPU, and Radeon Instinct GPU processors supported by High Bandwidth Memory (HBM) and extensive mixed precision ops for optimum deep learning performance;
  • A custom high-bandwidth, low-latency coherent Infinity Fabric, connecting four AMD Radeon Instinct GPUs to one AMD EPYC CPU per node;
  • An enhanced version of the open source ROCm programming environment, developed with Cray to tap into the combined performance of AMD CPUs and GPUs.

“We are excited to work with the team at AMD to deliver the Frontier system to Oak Ridge National Laboratory,” said Steve Scott, senior vice president and CTO at Cray. “Cray’s Shasta supercomputers are designed to support leading edge processor technologies and high-performance storage, all tightly interconnected by Cray’s new Slingshot network. The combination of Cray and AMD technology in the Frontier system will dramatically enhance performance at scale for AI, analytics, and simulation, enabling DOE to further push the boundaries of scientific discovery.”

AMD has a proud supercomputing history and a long-standing engagement with DOE, starting with the Jaguar supercomputer in 2005 and Titan supercomputer in 2011. The Frontier system leverages years of exascale technology investments by DOE. The contract award includes technology development funding, a center of excellence, several early-delivery systems, the main Frontier system and multi-year systems support. 

“Frontier represents the state-of-the art in high-performance computing. Designing and standing up a machine of its scope requires working closely with industry, partnerships which not only enable breakthrough science but also ensure American scientific and economic competitiveness on the global stage,” said Jeff Nichols, associate laboratory director for Computing and Computational Sciences, ORNL. “We are delighted to work with AMD to integrate the CPU and GPU technologies that enable this extremely capable accelerated node architecture.”

Additional Resources

  • AMD Exascale Computing Technologies
  • Cray Shasta Architecture

Follow AMD datacenter developments on Twitter @AMDServer







« Review: Cooler Master SK621 keyboard · AMD EPYC CPUs, AMD Radeon Instinct GPUs to power Cray Supercomputer · PNY releases XLR8 CS3030 NVME SSD with proper TBW values and perf »

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chispy
Senior Member



Posts: 9633
Joined: 2006-10-29

#5667739 Posted on: 05/10/2019 02:49 PM
Very interesting built , nice to see AMD chosen for such " Epyc " ( pun intended ) supercomputer ;)

HWgeek
Senior Member



Posts: 441
Joined: 2005-04-04

#5668269 Posted on: 05/12/2019 04:33 PM

After Watching this about Milan and the possibility that it will include 15 Chiplets and maybe SMT4, I think I Have an Idea where AMD is going with it's future(Maybe Custom design?) HPC EPYC design on 7nm+:
1)Each CPU chiplet will be 6C/24T to save space/power while giving similar or better then 8c/16t performance.
2)Adding 4 custom Instinct GPU chiplets.
3)Adding 2 custom AI accelerator chiplets.
4)1 I/O chiplet with HBM memory stack.

So the final EPYC Milan(?) can be HPC beast with:

48C/192T Zen CPU cores.
4 custom Instinct GPUs.
2 AI accelerator Asics.
1 I/O Chiplet with HBM 3D staking .




EDIT: I see that there was already great article on such HPC APU design:
https://www.overclock.net/forum/225-...lops-200w.html
So after reading some of it I changed my illustration:


And 8 Milans could be installed in Cray’s Shasta 1U with Direct Liquid Cooling:


https://www.anandtech.com/show/13616/managing-16-rome-cpus-in-1u-crays-shasta-direct-liquid-cooling
Do you think that such chiplet design could be beneficial for HPC clients?

Noisiv
Senior Member



Posts: 8230
Joined: 2010-11-16

#5668312 Posted on: 05/12/2019 08:51 PM
You didn't get my point, for long time Nvidia's GPU's were the obvious choice for those Supercomputers and you see that AMD and Intel's started to get their place, on Self-driving vehicles sector all saw that there is an option to develop better Asics for their own needs with "little" money and 2~3 years, so it seems that NV gonna have harder life for near future.


No bro. Doesn't work like that

According to the the USA exascale project strategy the DOE has put in writing the requirement that the project MUST NOT rely on the single best and the greatest hw, and instead it has to be built on several different architectures.
Is why you're seeing AMD GPU's there, being heavily subsidized by what seems to be a significant budget ramp up for exascale. Undoubtedly fueled by China's rising aspirations in the field and the whole bruhaha between the two countries.

That's why all of them (NV, intel and AMD) are getting a piece of the cake, regardless who has the best hw. Intel already fukd up once in delivery, that's why the need for redundancy and several contractors delivering different architectures.

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