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AMD Confirms HBA High Memory Bandwith for Graphics Cards
AMD also has shared more information about the choice for HBA graphics memory usage with it's upcoming Graphics Cards and APUs. Rumors have been on-going for a long time now.
HBA is a technology that uses multiple stacked DRAM dies with dedicated memory paths into a single package, cutting down on power-draw, thermals, and PCB materials. There will be three HBM memories available, 2Hi, 4Hi and 8Hi. If you look at a slide that AMD shared you will notice this is not '3D' stacked memory, but '2.5D'.
It is 2.5D because the the DRAM layers are stacked nect to the graphics processor. The DRAM layers and interposer are connected with a vertical through-silicon via tsv-channels that rest on a base layer. Tsv's form paths through the silicium and offers shorter paths. According to AMD HBM opposed to GDDR5 will offer a threefold in performance per watt and will result into 50% less power consumption. Details about the cards and solutions using HBM AMD has not shared yet.
AMD confirms Radeon HD 6950 1GB for $279 - 01/19/2011 12:16 PM
Advanced Micro Devices late on Monday announced the incoming of premium-class Radeon HD 6950 graphics board with reduced amount of onboard memory at $269 - $279 price-point as well as the massively f...
AMD confirms six-core desktop CPU - 09/23/2009 09:32 AM
We already mentioned in our Phenom II X4 965 that the next logical step for AMD is to intro six-core processors. It is now confirmed that the company will indeed release six-core desktop processors ne...
AMD confirms the launch of Fusion in 2011 - 08/04/2009 08:05 AM
It is apparantly now confirmed that AMD's first Fusion parts will see light as early as 2011 already. AMD Fusion is the codename for a future next-generation microprocessor design and the product of ...
AMD confirms 'Atom-smasher' chip - 07/19/2008 08:31 AM
AMD will unfold its plan to take on Intel's Atom in November, newly promoted CEO Dirk Meyer said last night.AMD's is currently working on a chip codenamed 'Bobcat', a single-core, 64-bi...
Reddoguk
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#5064837 Posted on: 05/07/2015 06:54 AM
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
Fox2232
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#5064863 Posted on: 05/07/2015 07:55 AM
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
schema
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
schema
Robbo9999
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#5064878 Posted on: 05/07/2015 08:27 AM
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
Yeah, I agree, I thought something similar when I saw the diagram of the HBM stacked memory being higher than the GPU core yet being right next to it. To me this would mean that heatsinks will have to be specifically designed to sit flat on the GPU core, and then have a step down to allow the HBM to fit. I think this would be a difficult design to manufacture accurately, and I think we will see inefficiencies with cooling due to heatsinks not mating to the surfaces properly, as well as the increased likelihood of damage being caused to the structure of the HBM when the heatsink is being placed & also when removed.
On a side note with HBM, it's just allowing larger bandwidths and throughputs, but AMD will need to manufacture an efficient core in order to take advantage of that extra bandwidth otherwise it's pointless.
Looking at those pictures then i'd have one slight worry about this stacked vram.
Getting off future HSF's might be a total nightmare, if the Vram is actually quite a bit higher than the GPU then i can see many a broken GFX card. You might in fact just twist it off with the heatsink
Yeah, I agree, I thought something similar when I saw the diagram of the HBM stacked memory being higher than the GPU core yet being right next to it. To me this would mean that heatsinks will have to be specifically designed to sit flat on the GPU core, and then have a step down to allow the HBM to fit. I think this would be a difficult design to manufacture accurately, and I think we will see inefficiencies with cooling due to heatsinks not mating to the surfaces properly, as well as the increased likelihood of damage being caused to the structure of the HBM when the heatsink is being placed & also when removed.
On a side note with HBM, it's just allowing larger bandwidths and throughputs, but AMD will need to manufacture an efficient core in order to take advantage of that extra bandwidth otherwise it's pointless.
geogan
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#5064948 Posted on: 05/07/2015 10:29 AM
Waiting for BF5 + DX12 + R395X. That should be a nice step forward.
Waiting for BF5 + DX12 + R395X. That should be a nice step forward.
fantaskarsef
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#5065005 Posted on: 05/07/2015 12:11 PM
So those are your plans for late 2016?
Waiting for BF5 + DX12 + R395X. That should be a nice step forward.
So those are your plans for late 2016?
intellimoo
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#5065367 Posted on: 05/07/2015 08:12 PM
Looks good, but no PhysX! :j/k:
Looks good, but no PhysX! :j/k:
ruiner13
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#5065575 Posted on: 05/08/2015 01:01 AM
What percentage of the cards power usage comes from memory vs. the GPU in, say, the 290? Will this shave a few watts or more than that?
I wonder how many layers they will have stacked, too. And are the memory and GPU cores fabricated at the process size. I'm assuming the RAM is fabricated elsewhere then fused with the GPU die, or else AMD is also getting into memory fabrication...
What percentage of the cards power usage comes from memory vs. the GPU in, say, the 290? Will this shave a few watts or more than that?
I wonder how many layers they will have stacked, too. And are the memory and GPU cores fabricated at the process size. I'm assuming the RAM is fabricated elsewhere then fused with the GPU die, or else AMD is also getting into memory fabrication...
fantaskarsef
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#5065655 Posted on: 05/08/2015 06:12 AM
If I recall correctly, it will have 4 layers at the start, but can go up to 8 layers with HBM gen 1. Might change later. Also, I wonder when they will start to think of putting two or more of those blocks onto a PCB
If I recall correctly, it will have 4 layers at the start, but can go up to 8 layers with HBM gen 1. Might change later. Also, I wonder when they will start to think of putting two or more of those blocks onto a PCB
darkshadow5k5
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#5065848 Posted on: 05/08/2015 12:30 PM
That looks very promising.
Increased x86 investments, I wonder why they would want to invest in x86-architecture instead of x64
x86 is x64.
x86-32 is what is referred to when people say 32bit
x86-64 is what is referred to when people say x64
That looks very promising.
Increased x86 investments, I wonder why they would want to invest in x86-architecture instead of x64
x86 is x64.
x86-32 is what is referred to when people say 32bit
x86-64 is what is referred to when people say x64
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That looks very promising.
Increased x86 investments, I wonder why they would want to invest in x86-architecture instead of x64