Product Teardown

Teardown

It is a request that is getting more and more daunting as we do not want to damage products. But user request on this is clear, you like a teardown and want to look to see what is going on at the PCB level. Opening up that trunk reveals a massive cooler. Nice to see are thermal padding everywhere and additional heatsinks in place at crucial segments. This also makes the card more sturdy, preventing it from bending. The backplate also reveals loads of thermal pads, helping cool down critical elements a bit. You'll notice that at that backside, for example, the GPU and GDDR6 IC locations are padded as well as part of the VRM. Power phases are setup as 5+2. The GPU voltage management is based on a UPI9512R. Looking closer at the photos, you'll notice that DrMOS for the GPU are On Semiconductor NCP302045. The memory subsystem makes use of a dual-phase power configuration managed by uPI uP1666Q. The GDDR6 chips themself register back as made by Samsung K4ZAF325BM-HC16, qualified and validated to run 16 Gbps. Interesting to see is that incredibly small PCB, that's a Mini ITX form factor at 17x17cm. You can also see two empty SMT traces for two more GDDR6 ICs.