Specifications & Features
Specifications & Features
HP is now offering three versions of the EX950 with the bigger models (512GB/1TB/2TB) have more endurance. The sample that has arrived for testing is the 1TB version of the drive. The EX950 series as stated will be fitted with 64-layer TLC written (3-bits per cell) 3D NAND flash memory (vertically stacked). This allows HP to offer the proper storage volumes., the EX950 models come with an added DRAM cache chips and a HP branded controller. HP offers a 5-year warranty for the EX950 series and the endurance ratings in TBW (terabytes written) are identical to the predecessor.
- 320 TBW for 512 GB model
- 650 TBW for 1 TB model
- 1,400 TBW for 2 TB model
So instead of using Planar NAND, 3D NAND is used. 3D TLC NAND is physical vertical NAND cell stacking not to be confused with chip stacking in a multi-chip package. In 3D NAND, NAND layers, not chips, are stacked in a single IC. The good news is continued cost reduction, smaller die sizes and more capacity per NAND chip. Also, installed NAND toolsets in the wafer fabs can, for the most part, be reused, thereby extending the useful life of fab equipment. The NAND ICs are driven by a HP controller, there is a DRAM cache up-to 1024 MB.