Intel Haswell-E Roadmap Confirms DDR4 - 8 Cores and Launch in Q3 2014
We have talked a lot about Haswell-E in the past already, as it is the next big thing in processor land to happen in 2014. A new roadmap leaked on the Haswell-E is an 8 core CPU series. Conformed now is that with the platform you'll get DDR4 memory. Quad-channel DDR4 RAM along with increased frequencies could lead to a near 50% increase in bandwidth compared to the older, triple-channel configuration which housed much more conservative RAM clock speeds. The high-end SKU will be priced at 999 USD.
The Haswell-E will be available in ‘K’ and ‘X’ options. The Extreme Edition variant denoted by the ‘X’ is the flagship SKU boasting 8 cores while the remaining processors would feature 4-6 cores depending on the model. The X99 series Chipset will feature USB 3.0 support and upto ten 6GB/s SATA Ports.
Haswell-E will use the latest 3D Transistor technology based on a 22nm fabrication process and will of course support Hyper Threading, Turbo Boost 2.0 and PCI-E 3.0.
|Model||Intel Core i7-5960X||Intel Core i7-5930K||Intel Core i7-4960X||Intel Core i7-4930K|
|Platform||Haswell-E||Haswell-E||Ivy Bridge-E||Ivy Bridge-E|
|Cache||20 MB L3||15 MB L3||15 MB L3||12 MB L3|
|Core Clock||TBA||TBA||3.3 GHz||3.3 GHz|
|Socket||LGA 2011-13||LGA 2011-13||LGA 2011||LGA 2011|
|Memory||DDR4-2133 MHz||DDR4-2133 MHz||DDR3-1600 MHz||DDR3-1600 MHz|
An X99 chipset will support low voltage (1.2V) DDR4 RAM kits (must be the 1333 MHz ones). The DIMM connector now has 288 pins (as opposed to 284 from earlier), the 4 additional pins added to support NVDIMM modules. Good news is that both 284/288 pin RAM modules will be usable on motherboards with the 284 pin connector or the new 288 pin connector.
Haswell-E will bring a new version of your same old LGA 2011 socket with it. Dubbed LGA 2011-3, the derived socket has the same dimensions and ball pattern pitch as LGA 2011. Basically, the number of pins remains the same while their layout changes. According to the slides, the new design is more efficient as per Intel’s research, and additional wings in the LGA 2011-3 socket help improve package handling. The first X99 motherboards are expected to be unveiled at Computex 201
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