A set of AMD Hawaii R9 290X GPU Specifications have been revealed by the German website 3DCenter.org. It is unclear how valid the specs really are. Key points: 4 raster engines, up to 2816 shader units, little bit more than 900 MHz base clock, temperature-controlled boost clock, 28nm process, around 430 mm² die-size, infos about process and die-size from an AMD interview with Forbes.
The 3DCenter website itself is in German, so this is a very rough Google translation, make of the information what you want:
From the corresponding speculative thread of our forum come first reasonably reliable data for Hawaii graphics chip from AMD's Volcanic Islands-generation , which AMD 25 September in the Radeon R200 series will introduce. However, the data stated are not speculations or assumptions, but come from a seemingly informed user - however, there is the residual risk that this is deliberate disinformation by AMD or the information in the transmission may have been partially corrupted. Thus, the following specifications are hardly ever can be laid on the gold scale - on the other hand correspond to these specifications Hawaii chip quite the preliminary expectations , that are realistic in every case:
28nm production at TSMC
~ 430mm ² chip area (18% on R1000/Tahiti)
2.0 GCN Architecture (R1000/Tahiti: 1.0 GCN)
DirectX 11.2 (as R1000/Tahiti)
4 raster engines (+100% over R1000/Tahiti)
max 2816 shader units aka 44 shader clusters - in any case more than the 2304 shader units, the GeForce GTX 780 (+37.5% compared to R1000/Tahiti)
Chip clock (Hawaii XT): slightly more than 900 MHz (similar to the Radeon HD 7970, but lower than the Radeon HD 7970 "edition GHz")
Temperature-controlled boost clock - the card is not able to play to their full performance due to limits on temperature and power consumption regularly
probably only a 384-bit DDR memory interface (such R1000/Tahiti)
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