Review: EVGA GeForce GTX 1080 FTW2
We check out the EVGA GeForce GTX 1080 FTW2 iCX 8G, and heck yeah this is not your regular one. Meet the all custom, cooled and tweaked EVGA "For-The-Win2" Edition. This SKU is a more premium version that comes with some new features, e.g. read sensors everywhere!
Read the full review here.
PCI Express 4.0 to offer double the performance
The PCI Special Interest Group (PC-SIG) announced there will be one more PCI Express standard before having to make the switch from copper to optical interconnects. The PCI Express 4.0 standard is expected to arrive around 2015 and promises 16 gigatransfers per second, double as much as the PCI Express 3.0 standard.
"The initial report we got yesterday is a PCI Express 4.0 is feasible--we have to work out the details, but it is feasible," said Al Yanes, president of the PCI SIG, speaking in a press briefing at the group's annual developers conference.
A exploratory group including members from AMD, Hewlett-Packard, IBM and Intel are conducting simulations using chip, channel, packet and socket data. They have determined throughput of at least 16 GT/s is possible and are expected to deliver a final report before the end of the year.
"We think we can eke out one more turn of the crank out of copper, so we are not looking at optics yet," said Ramin Neshanti, chairman of the PCI SIG's serial communications working chair.
It took the PCI SIG about four years to hammer out its 8 GT/s PCIe Gen 3 spec which required new signal encoding and equalization schemes. The Gen 4 spec should take a similar period, but this time the focus will be less on silicon and more on the board-level channels through which signals pass, Neshanti said.
Specifically, Gen 4 will probably be limited to distances of about eight to 12 inches compared to 20 inches for Gen 3. Engineers wanting longer reaches will need to use repeaters, a potential growth area for PCIe silicon.
The Gen 4 boards may need to use new materials, via designs and backwards-compatible connectors designed for improved signal integrity to reduce impedance discontinuities. "We think we have achieved about as much as we can scaling silicon," said Neshanti who also serves as an I/O standards manager at Intel.
That's a big shift for the PCIe community which has not previously required major changes of board makers. Typically the PCI SIG has thrown its hardest problems to chip makers such as AMD, Intel, NEC and others to ease problems for its less technically sophisticated supply chain among high volume PC board and system makers.
Nevertheless, some significant silicon shifts are ahead. Transceivers for Gen 3 were the first to use techniques to massage signals, adopting single-tap decision feedback equalization (DFE).
L.A. Noire arriving on PC this fall
Publisher Rockstar today announced that Team Bondi's 1940s detective thriller L.A. Noire will be released for PC this fall. he press release promises that not only will the PC release feature 3D support and 'improved graphical enhancements' but it will 'run on a wide range of PCs':
Developed by Rockstar Leeds and built to run on a wide range of PCs, L.A. Noire's robust feature customization includes keyboard remapping and gamepad functionality to both optimize and customize performance and user experience. Along with increased fidelity and improved graphical enhancements, the PC version will also feature 3D support for an even greater sense of interaction and immersion within a painstakingly detailed 1940s Los Angeles.
Originally developed by Team Bondi in conjunction with Rockstar Games, L.A. Noire is a crime thriller set in post World War II Los Angeles. As Detective Cole Phelps, players must search for clues, interrogate suspects and chase down criminals to solve a series of cases based on real world incidents. As he rises through the ranks of the LAPD, Phelps comes face-to-face with the corrupt heart of Los Angeles: from fallen starlets to double-dealing police officers and the vast reaches of the criminal underworld and finally, the darkness of his own personal demons.
Harry Potter and the Deathly Hallows Part 2 Game Trailer
Enermax flagship PSU series MaxRevo launched
Enermax extends it's PSU portfolio with the new heavy-hitting high-performance series MaxRevo with 1.350 and 1.500W. The new series fulfils not only the requirements of the directive "SSI Power Supply Design Guide" for servers, but it is designed especially for Multi-GPU systems and industrial PCs, as well as high-performance workstations. Equipped with six stable and highly efficient 12V rails this power supply delivers more than enough power for all modern server and high-end systems. A full modular cable management and further technological innovations top this high-end power supply off.
Enermax enters the heavyweight class with its new MaxRevo. It is a new high-performance series with numerous technological innovations of the premium manufacturer. For instance the "Copper-Bridge Array" transmission technology replaces the traditional wires and pass the signal straight and with lower resistance. The result is: up to three percentage increase of the voltage regulation and higher efficiency for clean and stable DC output.
Enermax has optimized the topology of the successful Modu87+ and Pro87+ series and could reduce further energy losses by this way. The patented high magnetic power density transformer replaces the Multiple-Transformer-Design (two and more transformers), which was up to now necessary in these wattage classes, and ensures more space inside the power supply. As a result it comes up much better air circulation. Together with the higher efficiency and the reliable Enermax Twister bearing fan it guarantees silent cooling.
The new FMQ-Design (Full-Zone Magnetic Quadrant Transformer Design ensures usage of four quadrants of the transformer instead of until now only one) makes a peak efficienncy of up to 94 percentage (80 PLUS
BAPCo responds to AMD's allegations
BAPCo responds to AMD's allegations about the SYSmark 2012 benchmark:
Business Applications Performance Corporation (BAPCo(R)) is a non-profit consortium made up of many of the leaders in the high tech field, including Dell, Hewlett-Packard, Hitachi, Intel, Lenovo, Microsoft, Samsung, Seagate, Sony, Toshiba and ARCintuition. For nearly 20 years BAPCo has provided real world application based benchmarks which are used by organizations worldwide. SYSmark(R) 2012 is the latest release of the premiere application based performance benchmark. Applications used in SYSmark 2012 were selected based on market research and include Microsoft Office, Adobe Creative Suite, Adobe Acrobat, WinZip, Autodesk AutoCAD and 3ds Max, and others.
Advanced Micro Devices (AMD) was, until recently, a long standing member of BAPCo. We welcomed AMD's full participation in the two year development cycle of SYSmark 2012, AMD's leadership role in creating the development process that BAPCo uses today and in providing expert resources for developing the workload contents. Each member in BAPCo gets one vote on any proposals made by member companies. AMD voted in support of over 80% of the SYSmark 2012 development milestones, and were supported by BAPCo in 100% of the SYSmark 2012 proposals they put forward to the consortium.
BAPCo also notes for the record that, contrary to the false assertion by AMD, BAPCo never threatened AMD with expulsion from the consortium, despite previous violations of its obligations to BAPCo under the consortium member agreement.
BAPCo is disappointed that a former member of the consortium has chosen once more to violate the confidentiality agreement they signed, in an attempt to dissuade customers from using SYSmark to assess the performance of their systems. BAPCo believes the performance measured in each of the six scenarios in SYSmark 2012, which is based on the research of its membership, fairly reflects the performance that users will see when fully utilizing the included applications.
PowerColor reveals dual-GPU Radeon HD 6870 X2
And another one, PowerColor announced a dual-GPU Radeon HD 6870 card. It has 900MHz GPUs and 2GB GDDR5 clocked at 4200MHz. Outputs include DL-DVI-I / SL-DVI-D/ HDMI/2 x mini Display Port, and oh my .. does this one look similar to Club3D's version.
TUL Corporation, a leading manufacturer of AMD graphics cards, today announces the very first dual GPU solution with BART XT graphics engine: the PowerColor HD6870X2. Powered by dual graphics engine, the PowerColor HD6870X2 delivers ground-breaking performance against the competitors and takes the game to the next level, enabling an unprecedented gaming experience you
Arctic Cooling Accelero Twin Turbo II VGA cooler
Arctic Cooling announced the Accelero Twin Turbo II, a new graphics card cooler with copper base, 35 aluminium fins, five heatpipes and two 92mm PWM fans with an airflow of 54CFM. The cooler is rated at 160W, which means top-of-the-line graphics cards aren't supported. It measures 217mm x 122mm x 53mm (L x W x H) and weighs 479g.
ARCTIC is proud to unveil the Accelero TWIN TURBO II, a multi-compatible VGA cooler featuring uncompromised cooling performance with wider compatibilities. Designed for mid-range to high-end VGA boards, the Accelero TWIN TURBO II optimizes the overclockability for enthusiasts, gamers and high-demand users.
Equipped with two 92mm PWM fans spinning up to 2,000 RPM, the Accelero TWIN TURBO II delivers generous airflow to cool down the GPU and surrounding components whenever possible. Heat from the GPU is transferred via 5 heatpipes and dissipated efficiently with the 35-fin aluminum heatsink. In order to extend the service life of the GPU, the ARCTIC MX-4 thermal compound is pre-applied at the copper base to increase thermal conductivity.
Taking multi-compatibility at heart, the Accelero TWIN TURBO II is equipped with a versatile and intuitive mounting mechanism to accommodate a broad range of models at present and in the future. A comprehensive cooling set comprised of RAM/VR heatsinks in assorted sizes is provided to accommodate different VGA boards. Speaking of RAM/VR cooling, the Accelero TWIN TURBO II provides the user with G-1, an electrically non-conductive thermal glue for affixing RAM/VR heatsinks. Unlike thermal tapes, G-1 delivers excellent thermal conductivity and long-lasting adhesiveness, while removal of it is extremely easy without leaving residues behind. Thanks to the low noise impeller and patented fan holder, the Accelero TWIN TURBO II is virtually silent under all circumstances. As the PWM controlled fans run according to the load generated by the GPU, noise level is always kept at the minimum.
Definitely another Best-Buy for cooling high-end graphic cards, the Accelero TWIN TURBO II comes with a 6-year limited warranty, with MSRP at $ 63.32 USD and
AMD shows off 32-core Bulldozer server
AMD demonstrated a 32-core Bulldozer server at the International Supercomputing Conference (ISC) as the Inq reports:
At AMD's ISC stand one could find several 2U and 4U servers built with older Opteron chips, but it was a 1U pizza box server made by Supermicro that housed two 16-core Bulldozer chips running live demonstrations of POVRay. This is the first time that AMD has publicly displayed its next generation Opteron processor, codenamed Bulldozer.
The chaps manning AMD's stand said that Bulldozer still has a Q3 2011 launch date and, judging by the fact that it has started to display working machines, we can assume that timeframe is not too optimistic. Asked whether AMD will be coming up with a Llano style Opteron featuring an accelerated processor unit (APU), AMD told The INQUIRER that "an Opteron APU still at least two years off".
Supermicro's 1U dual socket Bulldozer server packed in 32 cores, with space for an accelerator card. AMD said that other vendors are managing to put four sockets into a 1U server, resulting in a very impressive 64 scalar processing cores in just 1U. Although it wouldn't release exact thermal design power figures, AMD said that those will be the same as its Magny Cours Opterons'. The 16-core Bulldozer chips should once again put pressure on Intel's Westmere EX processors.
Crysis 2 DX 11 Hi Res Texture Packs in the works
A Direct X 11 Download Package Page on the MyCrysis has been uncovered, which will support the promised DirectX 11 update for Crysis 2, Crytek's shooter sequel, which is not yet available. Word is: "The DX11 Ultra Upgrade is a free visual improvement add-on introducing DirectX 11 support as well as a wealth of graphical improvements and performance optimization for both DX11 and DX9 API's.
When using the new 'Ultra' spec, DX9 platforms will beneficiate from realtime local reflections and contacts shadows.
The owners of DX11 platforms, in addition, will be able to enjoy hardware tessellation (requires the installation of the
Mars GPU PhysX Benchmark
A new GPU PhysX benchmark was revealed today
Club3D launches Radeon HD 6870 X2
Club3D is the first to launch a dual-GPU based Radeon HD 6870. The new Club 3D Radeon HD 6870 X2 2GB GDDR5 is the product that a gamer should look for nowadays. Offering on average 19% better performance in comparison to the best single GPU video card and now even more affordable, there is no other product in the market with a better price-/performance ratio.
- GPU Chipset: Barts XT
- GPU Clock: 900MHz
- Stream Processors: 1120
- Multi-GPU: CrossFireX
- Memory Size: 2048 MB
- Memory Interface: 256BIT
- Memory Type: GDDR5
- Memory Clock: 4200MHz
The Club 3D Radeon HD 6870 X2 features the CoolStream thermal solution and is bundled with the latest DirectX 11 Dirt 3. This card will be in the shops worldwide in the first week of July. Recommended enduser price ex VAT is USD 469.
Gigabyte 990 FXA-UD7 review
Man, look at what we are reviewing today, it is the 990FXA-UD7 from Gigabyte, recently they kicked out the baby blue color schema and went all black. This motherboards seriously has to be the most breathtaking thing to look at ever, from Gigabyte that is.
AMD completely released the 990FX chipset in the wrong time, it should have been released alongside the Bulldozer FX series processors. But ah well, what can you do .. have a peek at that crazy sexy looking UD7 and then let's head onwards into our review.
You can read this article right here.
Lian Li PC-A05FN ATX Mid-Tower PC Case
Lian Li releases an all-aluminum, high-end, mid-tower PC case available in silver or black called the PC-A05FN. With their commitment to optimizing instead of merely following convention, Lian Li's designers have positioned the PSU mount behind the front-panel at the base of the case, directly below the HDD cage. This unique design characteristic is complimented by a reversal of Lian Li's traditional front-to-back cooling scheme in order to achieve an increase in heat-dissipation within the PC-A05FN while reducing chassis size. With its chic and clean design, this computer case proudly bears all the markings of Lian Li's high-quality products and fits nicely into their list of outstanding 2011 releases.
In most of Lian Li's PC chassis front-panel fans are for intake and back-panel fans are for exhaust, but in the PC-A05FN this is reversed. At the top of the back-panel, a 120mm intake fan pulls cool air into the chassis. Hot air is expelled with the help of a front-panel, 120mm exhaust fan positioned directly in front of the HDD cage with the air escaping through venting along the side edges of the front-panel. For users who want to increase airflow, Lian Li has included a 140mm top-panel fan mount (fan not included). Additionally, designers have included a vent directly beneath the PSU mount, protected by a washable air-filter. Two rubber-lined holes on the back-panel enable LCS and venting along the back-panel also helps to keep temperatures cool, even when components have been overclocked. Also included is a fan speed control-switch mount (switch not included).
Tool-less and Anti-vibration Features
Internally, three 3.5" and two 2.5" HDDs mount using thumb-screws with rubber-suspension. Two 5.25" ODDs mount with Lian Li's tool-less design at the top of the front-panel. Directly beneath them, an external 3.5" HDD mount has been included as well. Additionally, there are eight, tool-less PCI brackets on the back-panel that can mount VGA cards as long as 280mm. Lian Li has made the PC-A05FN compatible with ATX, Micro-ATX, and Mini-ITX motherboards. The power switch is located along the right edge of the front-panel right above one USB 3.0 port, one USB 2.0 port, and HD Audio ports.
The all-aluminum, PC-A05FN weighs in at 4.4kg. Its dimensions are 210mm x 385mm x 500mm (W, H, D). This exceptionally designed computer chassis is sure to be a hit with users who like to be on the front lines of innovation without sacrificing quality or style. For more information, visit the product page.
ZOTAC GeForce GTX 550 Ti Multiview Graphics Card
AMD steps out of BAPCo consortium says SysMark is unreliable
AMD advises customers to avoid SYSmark 12 benchmark results because the benchmark has little in common with real-world tests.
AMD (NYSE: AMD) today announced that it will not endorse the SYSmark 2012 Benchmark (SM2012), which is published by BAPCo (Business Applications Performance Corporation). Along with the withdrawal of support, AMD has resigned from the BAPCo organization.
"Technology is evolving at an incredible pace, and customers need clear and reliable measurements to understand the expected performance and value of their systems," said Nigel Dessau, senior vice president and Chief Marketing Officer at AMD. "AMD does not believe SM2012 achieves this objective. Hence AMD cannot endorse or support SM2012 or remain part of the BAPCo consortium."
AMD will only endorse benchmarks based on real-world computing models and software applications, and which provide useful and relevant information. AMD believes benchmarks should be constructed to provide unbiased results and be transparent to customers making decisions based on those results. Currently, AMD is evaluating other benchmarking alternatives, including encouraging the creation of an industry consortium to establish an open benchmark to measure overall system performance.
AMD encourages anyone wanting more details about the construction and scoring methodology of the SM2012 benchmark to contact BAPCo. For more details on AMD's decision to exit BAPCo, please read AMD's Executive Blog authored by Nigel Dessau.
Intel 22nm Ivy Bridge further delayed to March 2012
Word from DigiTimes is that Intel has decided to postpone to arrival of its 22nm Ivy Bridge processors to March 2012. These chips were originally expected by the end of this year, but the chip giant has decided to give vendors more time to sell their Sandy Bridge notebook models.
Due to Intel Sandy Bridge's 6 series chipset design flaw, Intel recalled the products in January and launched a fixed chipset in April, leaving notebook players suffering from two months of lower demand. With the notebook market also experiencing an impact from the tablet PCs, Intel has decided to slow down its pace and re-organize its lineup by delaying the launch.
NVIDIA Tegra 3 Video pops up
Here's a video that shows off what phones with NVIDIA's Tegra 3 SoC (Kel-El) will be capable off. Ahw, it's like 2004 all over again isn't it ? Looks good though !
Intel adds four 17W mobile Sandy Brige CPUs
Intel has released out four new Sandy Bridge laptop processors with a TDP of just 17W.
All four offerings have 17W thermal envelopes and FCBGA1023 ball-grid-array packages, so they're sure to show up in ultraportables from various manufacturers. The Celeron 847's low price should make it ripe for cheap consumer ultraportables