Oak Ridge Labs supercomputer with 18,000 NVIDIA Tesla cards
Blimey ! NVIDIA send out word that Oak Ridge National Laboratory (ORNL) is building Titan, a new supercomputer that will use up to 18,000 Kepler-based Tesla GPUs.
NVIDIA today announced that Oak Ridge National Laboratory (ORNL), which operates the world's premier open science computing facility for the U.S. Department of Energy, will deploy a revolutionary new supercomputer, "Titan," based on NVIDIA
LG shows off 47-inch Full HD TV that uses just 28W
LG caught our interest soday by showing off a new 47" Full HD TV that uses only 28W. The high energy efficiency is achieved by using a single vertical edge backlight with a brightness of 400 nits.
LG Display, a leading innovator of thin-film transistor liquid crystal display (TFT-LCD) technology, today announced it has developed a 47-inch Full HD LCD panel, featuring vertical single side LED backlight technology, that offers maximum brightness while consuming less electricity than other LCD TV panels over 40 inches in size and even normal PC monitors over 20 inches in size.
The newly developed LCD panel achieves the world's lowest power consumption rate among large LCD panels by dramatically reducing the number of LED lamps used while maintaining a high level of brightness. To reduce the quantity of LED bulbs used, LG Display introduced its own backlight technology in which LED lamps are attached vertically to a single side of the panel, a world first for such technology.
Despite its large size, the 47-inch LCD panel uses only 28W, less than the power consumption of most 20-inch PC monitors which use between 30~50W. The LCD panel also delivers 400 Nits of brightness suitable for HD TVs through a three-film structure which helps focus and diffuse light, together with Local Dimming Technology and energy efficient LED bulbs.
Making it ideal for commercialization, the 47-inch LCD panel offers outstanding picture quality through its full HD resolution and ultra-slim design highlighted by its minimal 8.5mm bezel, in addition to its improved energy efficiency which will ensure cost savings for consumers.
"Together with our business partners, LG Display has developed this LCD technology to continue our commitment to improving energy efficiency with environmentally friendly solutions," said Shin Ho Kang, vice president and head of LG Display's LED Development Department. "We will continue to invest in developing more energy efficient technologies that can bring greater value to both the market and the environment."
The Darkness II - Darkling Trailer
AMD FX 8150 processor review
We review the AMD FX 8150 processor today. Previously know as Zambezi with its Bulldozer cores, today the FX series is released. It will be AMD's most high-end and complicated to fab processor series to date, yet will remain an affordable processor series.
As you probably know, the product tested today has eight (!) physical CPU cores, it will have a base clock of 3600 MHz, may Turbo towards 3900 MHZ and can peak a thread or two at a cool 4200 MHz. And that makes the FX series a multi-threaded monster. You can read our review right here.
OCZ RevoDrive Hybrid review
We review the RevoDrive Hybrid. The idea behind the device hints very much towards Intel's Rapid Storage technology where a HDD is being cached by a Nand flash storage unit. Being OCZ they are making it an enthusiast class performance product. The product we test today for example comes with a 1TB HDD, and a really large 100GB cache partition running over SF2281 controllers. OCZ then applies a mix of their VCA 2.0 technology
Check out the full review over here.
Intel Xeon E5 Sandy Bridge-E CPUs Launch Schedule
At this year's IDF conference, Intel made public the fact that it has delayed the arrival of its first Xeon E5 server processors, but nobody back then knew when these CPUs will arrive. A recent report however has managed to uncover the chip maker's plans regarding this new series of CPUs as SoftPedia reports today:
Previously, the Xeon E5 product families were scheduled for a Q4 2011 release, but CPU World has find out that Intel's current roadmaps place the launch of these chips in the second Q1 of 2012.
Just as their naming scheme implies, Xeon E5-1600 CPUs are to be installed in uni-processor machines while products in the Xeon E5-2600 range support dual-socket configurations.
Despite this difference, both of these Xeon CPU series will be compatible with Intel's socket R motherboards (LGA-2011).
Just like their desktop counterparts, the CPUs released in the Xeon 2600-series will feature HyperThreading, Turbo Boost technology, as well as the AVX and AES instructions, but they will also receive support for VT-x / VT-d / VT-c virtualization.
Next to the Xeon E5-2600 series, Intel also plans to release the Xeon E5-2400 processor family which also supports dual-socket systems and is compatible with LGA-1356 motherboards (socket B2).
As the E5-2400 processors will be based on the Sandy Bridge-EN architecture, they carry a tri-channel memory controller, compared to the quad-channel controller available in LGA-2011 chips.
Together with these three processor series, Intel will also introduce a quad-socket version of the Sandy Bridge-EP, dubbed the E5-4600, the launch of which has now been postponed for the second quarter of 2012.
All Xeon E5 processors will use the C600 chipset, code-name Patsburg, that we detailed in a previous report.
Sandy Bridge-EN and Sandy Bridge-EP CPUs feature as much as eight processing cores, pack up to 20MB of shared L3 cache, have a TDP rated between 80W and 150W, and support one or two Quick Path Interconnect links, depending on the model.
Intel Confirms Bundling LGA 2011 CPUs with Own-Brand Liquid Coolers
This is the first time that the chip maker will bundle any of its processors with a water cooling solution.
In addition to selling the liquid cooler as part of a kit, Intel also plans to release this solution separately (also a premier for the company), in order to address other platform as well.
The CPU water coolers that will be made available by Intel are built together with Asetek, a maker well renowned for its high-quality closed loop liquid coolers, and includes a water block and pump assembly that goes on top of the CPU and a 120mm radiator with a pre-fitted fan.
Both the pump and the fan were designed to feature blue illumination, which closely resembles the color of the Intel logo.
Pricing for the new coolers is unknown at this time, but these are expected to come out together with the first Sandy Bridge-E processors on November 14.
Intel 2012 SSD Roadmap Surfaces
VR Zone received details about Intel's 2012 solid state disk line-up covering everything from low th high-end:
Intel has plans for the solid state drive (SSD) market that look deep into 2012. It is becoming increasingly clear that the company wants to give its SSD portfolio the breakneck product cycle its processor lineup enjoys, that of generation leaps every year or so. Looking into 2012, we see new models targeting pretty much every market segment.
To begin with, Intel will enter 2012 calendar year with many of the products it introduced very recently, some it hasn't even done yet. These include the SSD 520 "Cherryville", SSD 710 "Lyndonville", SSD 720 "Ramsdale", and "Hawley Creek" mSATA SSDs. Several of these will launch within the fourth quarter of 2011. Intel will then allow these products to lead the portfolio for the remainder of 2011 and the first quarter of 2012 (i.e. till the end of March 2012).
In the second quarter of 2012, Intel will launch "Ramsdale MLC". Simply put, this is a variant of "Ramsdale" Intel SSD 720 series PCI Express SSDs, which uses 25 nm MLC-HET NAND flash memory instead of SLC NAND flash found on the standard "Ramsdale". MLC-HET allows Intel to double capacities, while offering comparable endurance to SLC, and much higher price per gigabyte. It does, however, come at the cost of slightly lower throughput. Hence, Ramsdale MLC isn't really a replacement, but more of an expansion of the 700 Series PCI Express family.
Around the same time, Intel will launch "King Crest", a successor of SSD 520 "Cherryville" family. This is most definitely a successor, since it uses 25 nm MLC-HET NAND flash instead of regular 25 nm NAND flash found on SSD 520. We don't expect any leaps in terms of capacities, but endurance, sequential data-rates, and throughput can be expected to go up. Like the SSD 520, "King Crest" comes in the 2.5-inch form-factor with SATA 6 Gbps interface.
Some really big changes are reserved for the third quarter of 2012. Here, we find a new product taking shape, codenamed "Taylorsville". This one is slated to succeed SSD 710 "Lyndonville", with significant increases in capacities. "Taylorsville" will be available in capacities of 800 GB, 400 GB, and 200 GB. Like SSD 710, it will make use of MLC-HET NAND flash, the 2.5-inch form-factor, and SATA 6 Gbps interface.
Finally, there is "Lincoln Crest", a successor of SSD 320 series. These drives will mark the transition of Intel's mainstream-thru-value SSDs to the SATA 6 Gbps interface. It will make use of MLC-HET NAND flash, and hence will be a lot more durable, and speedy compared to SSD 320 series.
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AMD FX watercooling kit gets pictured
I just got an email from AMD yesterday evening that AMD is shipping out coolign kits to reviewers, this must be it. A watercooling bundle for AMD's 8-core FX "Bulldozer" chips. It's unknown which models will be available with this cooler, which looks rather similar to the Antec Kuhler H2O 920.
The Asian site XFastet has posted up four pictures of the new water cooler that AMD will be offering for improved cooling of the new 8-core processors.
New ASRock X79 Extreme7 photos
Some new photos of ASRock's upcoming X79 Extreme7 motherboard have surfaced on TPU (through xfastest) today:
ASRock is readying is new, high-end socket LGA2011 motherboard targeting the upper-most tier of the PC enthusiast market, the X79 Extreme7. This board will be a part of the company's first wave of LGA2011 motherboards, which are slated for mid-November, 2011. Pictures scored by XFastest reveal the board to be filled to the brim with features. The CPU socket is powered by a 16-phase VRM making use of high-grade chokes, and server-grade poscap capacitors.
The socket is wired to six DDR3 DIMM slots arranged in sets of three on either sides of the socket, powered by a 4-phase VRM. Among channels A, B, C, and D; channels B and D have two DIMM slots wired, so if you have four DDR3 modules, you should populate slots 0, 2, 3, and 5; to take advantage of quad-channel DDR3 memory. There are heatsinks over the memory VRM areas, that are connected to the heatsink over the CPU VRM using heat pipes.
OCZ ZS series 650W power supply review
OCZ releases the ZS model in a three fold of models, a 550W model priced at 55 EUR, a 650 model priced at 65 EUR and a 750W model priced at 75 EUR (USD conversion is similar at the moment). The big question with it remain reasonably efficient and most of alls stable ? Today we'll grab a couple of other power supplies and see how efficient the PSU is and how well it behaves under load.
Read the review here.
Asus PCI Express 3.0 Compliant Maximus IV GENE-Z/GEN3
In short, it's the same as the Asus Maximus IV GENE-Z we reviewed yet now with Gen 3 support on the PCIe lanes.
ASUS announced another PCIe 3.0 compliant board, the Asus ROG Maximus IV GENE-Z/GEN3.
Asus' new motherboard uses the same design as the previous version of the Gene Z, which has now received PCI Express 3.0 compliant bridge chips to support this new standard.
Otherwise, the board is identical with its non-GEN3 predecessor and includes an important number of enthusiast features like AMD CrossFireX and Nvidia SLI support, ROG Connect support and an on-board Supreme X-Fi sound chip.
In addition to the two PCI Express x16 Gen 3 slots that are required for dual-GPU setups, Asus has also included an open-ended PCI-E x4 slot (this is only PCIe Gen 2 compliant).
Storage is provided by six SATA ports, two of the 6Gbps variety, and Asus has also included a USB 3.0 header which allows for two such ports to be routed to the front of the case.
Another two USB 3.0 ports can be found on the rear I/O panel along with an impressive number of USB 2.0 ports, two eSATA connectors, 7.1-channel audio with a digital S/PDIF output and a Gigabit Ethernet port.
Since we are dealing with an Intel Z68 board, the Taiwanese company has also included an HDMI video output, which is placed right below the S/PDIF connector.
This means that the Maximus IV Gene-Z is fully compatible with the LucidLogix Virtu on-the-fly graphics switching technology as well as Intel's Quick Sync technology. Smart Response is also supported.
CPU power is delivered by a complex Extreme Engine Digi+ PWM with an 8-phase design that Asus claims it can deliver a whopping 250A of current to the processor.
Pricing and availability details are sadly lacking from Asus' press release, but don't get too disappointed as there isn't any reason why you would need such a PCI Express 3.0 motherboard until Ivy Bridge arrives.
Gigabyte Force K3 gaming keyboard
Check out Gigabyte's Force K3 gaming keyboard. Pricing and launch date are still unknown.
It is a wired gaming keyboard featuring a sexy matte black coating, a durable chassis, and enlarged rubber domes which allow for a fast and reliable keystroke response.
The upcoming keyboard measures 490 (L) x 263 (W) x 32.8 (H) mm, it weights about 900 grams, and has a one-piece rubber sheet design, a 1.5meter cable, a gold-plated USB connector, blue LED indicators and some clearly-marked gaming keys.
Spire reveals three Kepler CPU coolers
Yep yep .. Kepler :)
Spire introduced Kepler, a new series of budget processor heatsinks. The basic Kepler cooler offers two direct-touch heatpipes and a heatsink with 45 aluminium fins. The Kepler II has three direct-touch heatpipes and 45 aluminum fins and the Kepler Pro edition offers four direct-touch heatpipes and 50 aluminium fins. All three models use a 92mm fan and come S420 thermal compound. Intel's Socket 775/1155/1156/1366 and AMD's Socket AM2/AM3 platforms are all supported.
The Spire all new Kepler universal micro-processor cooler series are direct contact heat-pipe solutions for Core i3/i5 and i7 from Intel and the AMD AM2/3/FM1 micro-processors. There are three (3) different models ranging from two up to four 6mm sinter powder heat-pipes which are in direct contact with the cpu heat-source, dissipating heat effectively and fast.
The high density fins are crowned with a powerful fan for high airflow and great cooling performance. The 92mm dc fan provides ample airflow and silent cooling at 19.0dBA. Compatibility is ensured with the multi-platform mounting clip for Intel 775/1155/1556 sockets and AM2/AM3/FM1 micro-processors. The Kepler series from Spire are build to deliver great cooling for maximum system performance.
Kepler USD 19.95 / EURO 14.99
Kepler II USD 25.95 / EURO 18.99
Kepler Pro USD 38.95 / EURO 27.99
CoD:Modern Warfare 3 - Redemption SP Trailer
Developing Rage for Consoles Was a Huge Mistake
id Software founder and programming legend John Carmack has just given a bold statement that may not pleased consoles gamers. He said, "one of the larger mistakes" he made with RAGE was allowing consoles to have an equal place in development alongside the PC.
In an interview to PC Gamer, John Carmack said, "When we started on the game six years ago, I looked at the consoles and said