Intel SSD 520 to succeed SSD 510
Intel's SSD 510 will be succeeded by the SSD 520 "Cherryville". The new variant will offer higher capacities and faster performance, expected availability is Q4 2011 as vr-zone reports.
Codenamed "Cherryville", Intel's new high-end client SSD series is called SSD 520. Its main design goals look to be to spread the series in capacities both higher and lower than what the SSD 510 series could address. While SSD 510 is available only in 120 GB and 250 GB variants, the new SSD 520 will add a higher capacity variant, 480 GB, and a lower capacity one, 60 GB. A new 160 GB variant is added in the middle, and 250 GB is replaced by 240 GB.
With client SSDs and client environment in general, sequential transfer speeds are the king, Intel gave out just one set of sequential transfer rates for the SSD 520 series, 530 MB/s reads and 490 MB/s writes; and just one set of random access throughput, up to 40,000 IOPS read and 45,000 IOPS write. These figures are known to vary between the different variants, and so we'll have to wait for the final specifications that are specific to variants.
VIA Labs second-gen USB 3.0 controller released
VIA Labs's second-generation VL811 4-port USB 3.0 controller has arrived:
VIA Labs, Inc., a leading supplier of SuperSpeed USB (USB 3.0) integrated chip controllers, today unveiled the VIA Labs VL811 4-port SuperSpeed Hub Controller. The VL811 is VIA Labs' second-generation USB 3.0 Hub product, and adds support for USB Battery Charging Spec. 1.2. Beyond transfer rates of up to 5Gbps, the VL811 features improved performance for new and existing devices with host controllers, and adds rapid-charging capabilities.
"VIA Labs VL811 builds on the success of the VL810, the world
The Elder Scrolls V: Skyrim Gameplay Videos
EVGA Z68 FTW motherboard review
Enough stuff to write about, let's have a peek and then head onwards into the review.
Thermaltake High-Efficiency Toughpower XT PSU Models
Thermaltake, an award winning state of art PC power supplies, the leader and pioneer in PC thermal solutions, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, with
AMD FX-Series CPUs pre-order spotted
According to Xbit laboratories, consumer Bulldozer chips were also delayed until the fourth quarter. Guru3D knows for sure it's half October.
The FX series lineup was expanded with several new models. In addition to FX-4100, FX-6100, FX-8100 and FX-8150 SKUs, AMD is going to launch quad-core FX-4170, and 95 Watt and 125 Watt versions of eight-core FX-8120. At least three microprocessors from original FX launch line-up surfaced today in a price list of Bottom Line Telecommunications online store:
AMD FX-8120 and FX-8150 CPUs are 8-core models with 8 MB L2 and 8 MB L3 cache. The processors operate at 3.1 and 3.6 GHz, and listed at $222 and $266 respectively. These prices should drop by $10 - $20 once the chips are released. Considering that AMD official prices in 1K quantities are usually $10 - $15 lower than the prices of production chips in this store, we can expect that official prices will be $185 - $200 for FX-8120, and $230 - $245 for FX-8150.
AMD FX-6100 has only 6 CPU cores, or 3 Bulldozer modules. As such, it has only 6 MB of L2 cache. The processor is clocked at 3.3 GHz, and up to 3.9 GHz when Turbo Core feature is active. Like eight-core CPUs, this model has 8 MB L3 cache. The FX-6100 is listed at $188, and its expected official price is $155 - $170, or close to current official price of Phenom II X6 1055T.
The table below contains a summary of FX-6100, FX-8120 and FX-8150 details:
|Model||Cores||Threads||Frequency||Turbo Frequency||L2 cache||L3 cache||TDP||Price|
|FX-Series FX-6100||6||6||3.3 GHz||3.9 GHz||6 MB||8 MB||95 Watt||$188.32|
|FX-Series FX-8120||8||8||3.1 GHz||4 GHz||8 MB||8 MB||125 Watt||$221.73|
|FX-Series FX-8150||8||8||3.6 GHz||4.2 GHz||8 MB||8 MB||125 Watt||$266.28|
Star Wars: The Old Republic Smuggler class trailer
AMD Catalyst 11.9 RC Out for Grabs
Props to asder00 for this find. A new release candidate Catalyst 11.9 driver has been found. We mirrored the drivers onto our file-servers.
These leaked drivers are modified to work with all cards. There are no release notes. The driver package contacts the 32- and 64-bit binaries for XP, Vista and Windows 7.
Have a peek in this thread for more info.
TSMC Raises Prices on AMD and Nvidia GPUs, Apple Partially to Blame
TSMC has reportedly increased the prices of wafers manufactured using the 28nm fabrication process says sofpedia, a decision which could increase the production costs of next-generation GPUs developed by AMD and Nvidia as both companies rely on the advanced 28nm node for their chips:
According to unnamed sources, TSMC has taken this decision since they see a lot of demand for their 28nm process.
Most of the demand for the 28nm node reportedly comes from Apple, which has reached an agreement with the Taiwanese foundry to manufacture the system-on-a-chip (SoC for short) devices used inside the iPhone and iPad.
In addition to the high 28nm chips volumes required by Apple, TSMC is having troubles with achieving high yields on this manufacturing process, an issue which also leads to increased production prices for such devices.
Both Nvidia and AMD are relying on TSMC's 28nm fabrication process to develop their next-generation graphics cores, which are known under the code names of Kepler and Southern Islands, respectively.
Furthermore, reports suggest that Nvidia has also started to build a new series of refreshed notebook parts based on this advanced fabrication node.
At the end of July, TSMC representatives admitted the company is having troubles with the ramp up of 28nm parts, but noted that these aren't caused by quality issues, but rather by the weak economy and low demand for such products.
AMD is expected to launch its first Radeon HD 7000 graphics cards built using the 28nm node by the end of this year, while more parts will arrive in the first quarter of 2012.
As far as Nvidia is concerned, its first next-generation GPUs, based on the Kepler architecture, are expected to arrive at the beginning of next year.
MSI shows LGA 2011 Motherboards at IDF 2011
As they did on computex, MSI will show a series of MSI LGA 2011 motherboards based on the Intel X79 chipset.
The X79 features a PCH (platform controller hub) design as most of the tasks that were handled by the X58 chipset previously, such as PCI Express connectivity, were integrated inside the Sandy Bridge-E CPUs.
The X79 packs an impressive array of features compared with its predecessors as it now supports no less than 10 SATA 6Gbps, while the PCH is linked to the CPU via a DMI 2.0 interface as well as through an additional PCI-Express 2.0 x4 link.
In addition, the X79 PCH also features an Intel Rapid Storage enterprise controller that enables RAID 0/1/5/10 support and eight of the available SATA interfaces can be configured as SAS ports by motherboard manufacturers.
The rest of the specs list includes an 8-lane PCI-Express 2.0 hub, which can be used to drive the x1 and x4 slots, as well as 14 USB 2.0 ports.
Unfurtunately the PCH doesn't feature native USB 3.0 or Thunderbolt support, which is an important omission considering its target market.
Battlefield 3 Operation Guillotine Trailer
Fast Boot Times in Windows 8 Video
Corsair New High-Speed USB 3.0 Flash Drives
Flash Voyager GT USB 3.0: Superior Speed and Renowned Flash Voyager Durability
The premium performance Flash Voyager GT USB 3.0 provides data transfer rates of up to four times the speed of USB 2.0 drives, and even two times the speed of standard USB 3.0 flash drives
ECS A75F-A motherboard review
Today we look at a A75 motherboard from ECS, in the 100 EUR bracket they have released the A75F-A, a board that ECS decided to pair with two PCI Express x16 slots (the second one is x4 electronically), two PCI Express x1 slots as well as with no less than three legacy PCI slots.
This is the kind of stuff that ECS shines at, have a peek at the motherboard and read the review right here.
AMD adds AMD Fusion APUs A4 Series
AMD announced availability of the AMD A-Series Accelerated Processing Unit (APU) A4-3300 and A4-3400 desktop processors, bringing the entry-level desktop APU price down to just $70 (U.S. suggested retail price) for consumers who want PCs with brilliant HD graphics, advanced performance, and fast application and connectivity speeds.
The AMD A4-3300 and A4-3400 desktop APUs each combine two x86 CPU cores with 160 Radeon cores, enabling powerful DirectX 11-capable discrete-level graphics and dedicated HD video processing on a single chip. These dual-core APUs enable responsive and energy-efficient performance for everyday PC productivity and multitasking, as well as an amazing gaming experience.
In addition to leading-edge graphics and competitive compute power, the AMD A4-3300 and A4-3400 APUs support:
- AMD Steady Video for instant removal of shakes and jitters when re-watching video, so content looks steady and smooth.
- AMD Dual Graphics for a visual performance boost when paired with select AMD Radeon HD 6000 Series graphics cards.
- Integrated USB 3.0 controller for rapid transfer and storage of digital content.
- AMD VISION Engine Software to provide users with regular updates to help improve system performance and stability, and to introduce new software enhancements.
With a suggested retail price of $75.00 (U.S), the AMD A4-3400 APU operates at 2.7GHz (CPU) and 600MHz (GPU) with 160 Radeon Cores, 1MB of L2 cache and a TDP of 65W.
ASUS 6770 DirectCU Silent is a passive card
ASUS laucnhed the Radeon HD 6770 DirectCU Silent, claiming this is the coolest passively cooled graphics card on the market. The card has a 850MHz core and 1GB GDDR5 clocked at 4000MHz.
With the release of the new HD 6770 DirectCU Silent, ASUS has deployed the most powerful and advanced fanless graphics cards available. Running totally silent and 16%* cooler than generic passive designs, the ASUS DirectCU Silent series increases thermal performance and offers consumers a more reliable and longer lasting experience that meets every graphics need, from casual multimedia to dedicated gaming.
DirectCU Silent technology offers 95%* larger heatsinks for 16%* cooler performance
ASUS thermal engineers have developed exclusive DirectCU cooling technology, integrating direct-contact copper heat pipes that touch the GPU core for faster and more effective heat dissipation, and thus lower temperatures and better performance. Based on these principles, ASUS engineers have created the most effective 0dB silent graphics cards available. DirectCU Silent designs have been applied on the GT 430, GT 440, GTS 450 and HD 6670 previously, and now on the HD 6770 model. Through intricate material processing and intelligent molding, the heatsinks in DirectCU Silent cards offer up to 95%* larger surface area and run around 16%* cooler than conventional passive cards, resulting in more stable performance and longer lasting products.
Super Alloy Power enhances product longevity and performance
Based on a proprietary alloy mix developed in-house by ASUS, Super Alloy Power involves filling power delivery components with a high endurance compound that can better resist heat. Super Alloy Power components lead to 15%* faster performance, a wider overclocking margin, and products that last 2.5* times longer than generic graphics cards.
Delivering cool and stable gaming performance
TSMC thinks 14nm by 2015
You have to wonder at what point they can't make it any smaller right ? TSMC R&D head Shang-yi Chiang said volume production of 14nm chips is expected to happen in 2015. Additionally, he also reveals this process node will use 450mm wafers:
Taiwan Semiconductor Manufacturing Company (TSMC) will conduct R&D for 14nm process technology starting 2012, and expects to begin volume production on the node in 2015, according to Shang-yi Chiang, company senior VP of R&D. TSMC will use 18-inch wafers to process 14nm chips, said Chiang, adding that manufacturing with larger wafers helps increase its ability to produce at a lower cost.
The transition to larger, 18-inch-sized wafers will also allow TSMC to build fewer fabs, meaning that labor and land costs can be reduced, Chiang pointed out. In its ongoing advanced technology development, TSMC is actually facing a shortage of engineers rather than technical issues, Chiang added.
Shuttle fanless slimline XS35 V2 barebones
Shuttle introduced version 2 of its 38mm thin XS35 barebone lineup.
Shuttle Computer Handels GmbH, European subsidiary of Shuttle Inc., one of the leading developers and manufacturers of compact PC solutions such as the world-renowned XPC Mini PC Barebones today announces the sales launch of Version 2 of its XS35 product line.
Just as its predecessor, the new generation of XS35 models is built around energy-saving components and runs virtually silently. The new XS35 series does away with any fans and remains nearly inaudible at any time which predestines such space-saving PCs use in the living room at home, in the office, classrooms and even in libraries. The energy-efficient Intel Atom D525 processor provides sufficient power for all daily computing applications. While the basic version, XS35V2, comes with integrated Intel GMA 3150 graphics, the XS35GTV2 barebone is equipped with NVIDIA