Activision has already announced plans for another Call of Duty title next year, as Modern Warfare 3 posts the largest day-one shipments in gaming history.

On top of that, Activision is promising at least two titles from Blizzard next year.
It doesn't take a seasoned industry watcher to guess that Activision's blockbuster Call of Duty series--an annualized franchise since 2005--wouldn't make it through 2012 without a new release. The publisher confirmed as much in its quarterly earnings report, adding that today's launch of Call of Duty: Modern Warfare 3 boasted the largest day-one shipments in gaming history. "As we focus on 2012, we have a strong product pipeline which features a minimum of two highly-anticipated new titles from Blizzard Entertainment, including Diablo III, and a new Call of Duty game from Activision Publishing,"

Activision CEO Bobby Kotick said in a statement accompanying the publisher's quarterly report. Beyond Diablo III, Blizzard has an assortment of projects in the works, including the World of Warcraft expansion Mists of Pandaria, Starcraft II: Heart of the Swarm, Blizzard DOTA, and a still-unannounced massively multiplayer online role-playing game developed under the code-name Titan.

Noctua today introduced the new NF-F12 120mm Focused Flow fan. Teaming up eleven stator guide vanes with a specially conceived seven blade impeller, the NF-F12

The new Sitecom Media Player comes standard with a new improved GUI, but also hardware wise harbor the latest Realtek 1185 chipset, and that changes a thing or two as pretty much any of the performance issues we had noticed in 1080P content playback (with very high bit-rate) on the previous chipset now are a thing of the past.

That Realtek 1185 chipset has an increased clock frequency, 500 MHz coming from 400 MHz on the original version. And as little as it sounds, it makes a serious difference. The HDD TV Media Player 2TB allows you to play digital films, music and photos directly on your TV with High Definition quality (1080p).

Check out the review right here.

A week or two ago we heard that Nvidia's plans to release a slightly more powerful version of the GTX 560 Ti at the end of last month and recently a report has popped up online that provides a full list of specifications for the graphics chip maker's next GPU.

Compared to its older brother, the GTX 560 Ti (448 Core) will come with one of the 15 streaming modules disabled, to provide a total of 448 CUDA cores.

The rest of the core includes 56 texture units, 40 ROP units and a 320-bit memory bus connected to 1.25GB of video buffer, just as is the case with the GeForce GTX 570.

The card's operating frequencies will also mimic those of its older brother as the GPU will work at 732MHz, while the GDDR5 video buffer is clocked at 950MHz (3.80GHz effective). Together with the increased performance offered by the new graphics core, the power consumption of the card has also grown since the GTX 560 Ti 448 uses the same 0.950V to 1.100V voltage range as the GTX 570.

Other features of the GTX 560 Ti (448 Core) include support for 3-way SLI, DVI, HDMI and DisplayPort video outputs. This is not the first time that Nvidia has decided to increase the shader count on one of its graphics cards as the company has also done the same with the GTX 260, which soon after its introduction received a 216 Core version.

The GTX 560 Ti 448 Cores will be officially launched on November 29 from what we heard, and its recommended price is expected to be on par with that of the original GTX 560 Ti.

AMD is expected to unveil its first APUs based on the Bulldozer architecture, code named Trinity, more information about these chips making its way just recently to the Web as soft-pedia reports today:

The new Trinity pictures and slides confirm a series of other leaks that made their appearance in the last couple of weeks, but also bring a series of new details about the AMD chips.

Some of the most important of these come from a table showing the specifications of AMD's engineering sample Trinity APUs, which include either two or four Piledriver processing cores and have TDPs of 65, 100 or 125 Watts. The operating frequencies seem to vary from 2.2GHz to 3.8GHz, and with the help of Turbo Core 3.0 technology some of these APUs can even reach or go beyond the 4GHz mark.

As far as the integrated graphics is concerned, this seems to be clocked between 563MHz and 711MHz, and Turbo Core should also be able to increase these frequencies to higher values. AMD's next-generation APU combines processing cores based on the Bulldozer architecture with a VLIW4 GPU derived from the Cayman graphics used inside the Radeon HD 6900 series.

These cores will go by the name of Piledriver and, much like the current Llano APUs, lack any sort of Level 3 cache memory as AMD wanted to increase the die area available to the on-board GPU.

ENERMAX is pleased to announce the new flagship tower series: Fulmo GT and Fulmo. They are the fusion of performance and style, with exceptional compatibility and ease-of-use design. This series comes in both full-tower and mid-tower sizes, each providing different configurations. The Fulmo and Fulmo GT meet different demands from advance users to performance craving enthusiasts.

A Monster Is Never Full
Fulmo GT is a HPTX MB-supported full-tower case. Its jaw-dropping volume allows massive storage of up to 14 devices, dual PSU mounts, and quad VGA cards with 425mm /16.73 inches in depth with astonishing support for 15 to 20 fans.

Newly-adopted 18cm Vegas LED fans with multi-lighting keeps you delighted by its nice effects. An integrated fan speed knob allows total control of three fans to provide dynamic thermal solution for systems under different loads. In addition, there are more than sufficient USB 3.0 ports with one external SATA dock that makes massive data transfers in no time.

Whether you are looking for a robust workstation or want to build an ice fortress for your hard-core gaming rig, Fulmo GT is definitely your answer!

No more struggling for inches
Though packed in mid-tower size, there is no compromise on its performance. Fulmo proposes a real novel solution for space restrictions, which allows up to 410mm/16.14 inches of clearance for VGA card installations, and saves struggling for inches or trade-off between HDD devices.

In addition, the Fulmo has upgradability for triple VGA cards and a total of 10 to 14 fan mounts, makes it the ideal choice to maintain pleasant temperature while keeping extreme visual experience.

Sharing the same design attributes with Fulmo GT, the Fulmo inherits the fan LED control, top USB 3.0 interface, and external SATA dock. All in all, Fulmo surpasses rivals both functionally and aesthetically.

Cooler Master introduced its first CPU cooler with support for Intel's LGA2011 processors; the Hyper 412S. This new HSF will be available soon for 35EUR, it offers four direct-touch 6mm heatpipes, aluminium fins and a 120mm "long life" sleeve bearing fan that delivers 52.6CFM at a noise level of 22.5dBA. The cooler measures 132mm x 99mm x 160mm and weighs 609g with fan included.

Cooler Master, an industry leading chassis, thermal solution, peripheral, and accessory manufacturer brings a new CPU cooler to light, the powerful Hyper 412S CPU Cooler, which targets a delicate balance between cooling potential and noise. The Hyper 412S perform extraordinarily well while maintaining minimal noise levels.

Innovative design and materials
The Hyper 412S CPU Cooler is designed for optimum heat dissipation at low fan speeds. This is thanks to wider fin gaps and a precise heat pipe layout that directs each of their four heat pipes across CPU

So in theory its slowly becoming a chassis again ? :)

Sharkoon shows off the SATA QuickDeck Pro, a stackable docking station for 2.5" and 3.5" SSD/HDD storage devices. The product offers USB 3.0 support and should be available in retail stores for around 27.99EUR.
In addition to their well-known "QuickPort" docking stations, which provide computer connection to unobstructed SATA hard drives, the Sharkoon "QuickDeck" has long been a table adapter in their product line in which data mediums are not standing upright, but rather inserted laying down. The Sharkoon QuickDeck is also immediately available in a "Pro" edition, with a USB3.0 port and stacking feet.

The Sharkoon QuickDeck offers room for SATA hard drives in both 2.5 and 3.5 in formats. The drives are simply inserted horizontally into the front and open top plastic frame. A rail fixed to the floor folds up for smaller 2.5 inch hard drives. The hard drive can be easily detached from the QuickDeck with the help of an ejection lever attached with the SATA port. External connection occurs over the fast USB3.0 port.

Small, round rubber feet on the bottom gives the QuickDeck Pro a non-slip grip. The topside is provided with matching grooves so that several QuickDecks can be stacked to save space and provide simultaneous hard drive connection. The QuickDeck is equipped with a separate power switch and blue operating LED, supports the operating systems Windows XP, Vista and Windows 7 (32 bit and 64 bit), measures 180 x 143 x 40 mm (L x W x H) and weighs 240 grams. In shipping you will find an instruction manual, power supply and USB3.0 cable.

Following the release of the already popular Bluetooth based Chill KB-1BT Micro Keyboard; Danish company Chill Innovation A/S has now also launched a 2.4G RF based version optimized for HTPC (Home Theater PC), Playstation 3 and Xbox 360. The new Chill KB-1RF Micro Keyboard comes factory pre-paired with the tiny Nano USB dongle included. Just plug it in your host, and you are in control.

The wireless Chill KB-1RF Micro Keyboard can also be operated in BIOS environment etc. Furthermore it supports Wake-on-USB, so you can turn on your PC right from the Keyboard (when supported by the host)

A new slide leaked over at Donim Haber, this time they leak info on the upcoming AMD 1090FX and 1070 Chipsets.

In 2012 AMD is to launch the new chipset as succesor to the 900 series, alongside the second-generation Bulldozer (codenamed "Piledriver") processors.

1090FX will be designed to give out two PCI-Express x16 links, which can then drive up to four graphics cards. The 1070 has just one x16 link, which can drive up to two graphics cards. A

Interesting enough is that the 10-series chipset does not seem to support PCI Express Gen 3.0, it is highly likely that AMD's Radeon HD 7000 series graphics  will support PCI-Express 3.0 interface.

The new chipset will get a new SB1050 southbridge, which outpaces Intel's 7-series chipset in terms of connectivity. SB1050 will pack an 8-port SATA 6 Gb/s RAID controller. All ports will run support 6 Gb/s data-rate. The SB1050 will get native USB 3.0 SuperSpeed controllers.

Zalman is getting ready to ship the CNPS11X Performa, a new processor cooler with a V-shaped dual heatsink design. The cooler has four direct-touch heatpipes and a 120mm PWM fan with a noise level of 17dBA to 26dBA.

It weighs 450g and measures 135mm x 80mm x 154mm (L x W x H). All current processor platforms are supported, including the Intel LGA 775/1155/1156/1366/2011 and AMD Socket AM2/AM2+/AM3/FM1.

The Zalman CNPS11X Performa should ship later this month, it's currently available for pre-order in Europe for around 29EUR.

OCZ CEO Ryan Petersen talked about triple-bit-per-cell (TPC) NAND flash based solid state disks at last week's Needham HDD and memory conference. Petersen said these disks should arrive next year, with prices significantly lower than those of MLC-based SSDs. The downside however is the much lower redundancy of TLC flash memory, but according to Petersen this should not be a problem for the low-end servers, consumers, laptops, and retail sub-segments.

"We announce [the intention to ship] TLC-based drives! [...] People have been talking about [TLC-based SSDs] for a long time and we have now put ourselves with next-gen [Indilinx Everest] controller, which we are shipping in January, and position it for low-end servers, consumers, laptops, retail; those sub-segments that really can adopt TLC-based solutions. This is really where we can get over four years of life [of SSDs]," said Ryan Petersen, chief executive officer of OCZ at the Needham HDD and memory conference.

Triple-bit-per-cell (3bpc) NAND flash is relatively cheap in manufacturing, but its redundancy is dramatically below that of multi-layer cell [MLC, 2bpc]: around a 1000 writes (for TLC) versus 10000 writes (for MLC) and simply cannot be compared to the number of write cycles for SLC [single layer per bit] which are around 100 000.

French news site, TFI reports that a delivery truck was hijacked and its contents of 6,000 copies of Call of Duty: Modern Warfare 3 were stolen.

The truck was hijacked after a collision with a car in Cr

Hummana-humman me likey. Check out some photo's of the upcoming MSI Big Bang-XPower II. Very little, to well  nothing is known about this board. But just check out the design.

MSI is now also applying a bit of an ammo theme, yet by far more subtle then gigabyte has shown with their latest X79 board (at least to my opinion).

The motherboards comes with 7 PCie x16 slots and we count ten SATA ports, likely 4 SATA2 and 6 SATA3. We spot voltage check points, on board buttons and that all black design is just scrumptious really.

The board comes with 8 DIMM slots supporting up-to 64GB of memory surrounding that big LGA2011 socket for next weeks released Sandy Bridge-E series processors.

Anyway, click the thumbnails below for larger size photo's.

OCZ Technology launched the RevoDrive 3 Max IOPS and RevoDrive 3 X2 Max IOPS solid state drives. Designed to deliver maximum throughput in multithreaded applications, the new Max IOPS edition is an extension of the company's industry-leading RevoDrive 3 product line, supporting workstation users that require greater transactional throughput and bandwidth.

The RevoDrive 3 X2 Max IOPS series combines a proven cutting-edge PCI Express architecture and OCZ proprietary Virtualized Controller Architecture