Intel, Samsung and TSMC have reached an agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.
The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications. The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.
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