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 Computex 2009 - Day 3 - The big One Oh One

 By: Hilbert Hagedoorn Edited by John A. Johnsen | Published: June 4, 2009  


Computex 2009 - Day 3

So then, other builder-friendly features include four hot swap SATA bays and a cut out section in the mainboard tray, doing away with the hassle of removing the mainboard to change CPU cooling products in the future. More importantly is the cable management system that helps keep everything in an orderly manner while improving airflow. Expect to see the Corsair Obsidian Series 800D Chassis hit stores early July for a fairly hefty $299.

Computex 2009 - Day 3

In collaboration with Asetek, Corsair developed the new H50. it is a new self-contained CPU liquid cooling product called the H50. Though it is quite obviously based on an Asetek unit, Corsair claims that this is the best performing unit Asetek has ever developed and that Corsair has exclusive rights to sell it.

From what we have seen here at Computex, it performs well. But we'll likely check that out in a review with hands on experience rather than seeing preconfigured systems running Prime95.

Computex 2009 - Day 3

That liquid cooling you spot on the memory is the new their TEC-based water-cooling solution for memory modules.

 



 


 

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